Disclosed are resin compositions that include poly(arylene ether), HIPS/GPPS), impact modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low level. The compositions also possess excellent mechanical and processing performance, for example, superior high impact strength and good ductility, compared to prior art compositions. The compositions can be used to form components of wireless electronic communications devices in order to ensure a low degree of signal attenuation.
公开的
树脂组合物包括聚(芳基醚)、HIPS/GPPS)、抗冲改性剂和陶瓷过滤剂,可提供各种 Dk 值,同时将 Df 保持在非常低的
水平。与现有技术的组合物相比,这些组合物还具有优异的机械和加工性能,例如出色的高冲击强度和良好的延展性。这些组合物可用于构成无线电子通信设备的部件,以确保较低的信号衰减。