1,2-环氧-6-(2,3-环氧丙氧基)六氢-4,7-甲桥茚满 | 3712-92-3

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 异戊烯醇脂质
• 中文名称: 1,2-环氧-6-(2,3-环氧丙氧基)六氢-4,7-甲桥茚满
• 英文名称: 1,2-Epoxy-6-(2,3-epoxypropoxy)hexahydro-4,7-methanoindan
• 英文别名: 10-(oxiran-2-ylmethoxy)-4-oxatetracyclo[6.2.1.02,7.03,5]undecane
• CAS: 3712-92-3
• 化学式: C₁₃H₁₈O₃
• 分子量: 222.28
• InChiKey: NJBGVARMYOOVSX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  5.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  34.3
• 氢给体数：
  0
• 氢受体数：
  3

安全信息

• 海关编码：
  2932999099

文献信息

• PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM
  申请人：Enomoto Yuichiro

  公开号：US20120282548A1

  公开（公告）日：2012-11-08

  Provided is a pattern forming method comprising (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (D) a solvent, and (G) a compound having at least either one of a fluorine atom and a silicon atom and having basicity or being capable of increasing the basicity by the action of an acid.

  提供的是一种形成图案的方法，包括(i)使用光致或辐射敏感树脂组成物形成薄膜的步骤，(ii)曝光薄膜的步骤，以及(iii)使用有机溶剂含有的显影剂显影曝光后的薄膜的步骤，其中光致或辐射敏感树脂组成物包括(A)一种能够通过酸的作用降低有机溶剂含有的显影剂的溶解度的树脂，(B)一种能够在光致或辐射照射下生成酸的化合物，(D)一种溶剂，以及(G)一种具有氟原子和硅原子中的至少一种，并具有碱性或能够通过酸的作用增加碱性的化合物。
• Novel epoxy hardeners
  申请人：W.R. Grace & Co.-Conn.

  公开号：EP0271808A2

  公开（公告）日：1988-06-22

  This invention relates to the use of compositions of the formula: wherein n is 2 to 4 and X is -O-, -S- or wherein R₁ is an aliphatic or aromatic moiety as a curing agent for epoxy resins to form a thermoset material which has a reduced shrinkage.

  本发明涉及以下式子的组合物的使用： 其中 n 为 2 至 4，X 为 -O-、-S- 或 R₁ 为脂肪族或芳香族分子，用作环氧树脂的固化剂，以形成收缩率降低的热固性材料。
• Epoxy resin encapsulation compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285938A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 由六氢-4-甲基邻苯二甲酸酐组成的固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂。 封装剂 (11) 还可选择包含辅助固化催化剂、热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。 还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。 还提供了一种封装固态器件的方法。
• Epoxy resin compositions and solid state devices encapsulated therewith
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285939A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant (11) may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 至少一种酸酐固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂；以及(E) 可选的至少一种辅助固化催化剂。封装剂 (11) 还可选择包含热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。还提供了一种封装固态器件的方法。
• Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1408087A1

  公开（公告）日：2004-04-14

  Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising a composition of the invention. A method of encapsulating a solid state device is also provided.

  本发明公开了环氧树脂组合物，其中包括 (A) 至少一种硅树脂、(B) 至少一种环氧树脂、(C) 至少一种酸酐固化剂、(D) 至少一种硅氧烷表面活性剂和 (E) 至少一种辅助固化催化剂。还公开了一种封装固态器件，包括封装、芯片（4）和包含本发明组合物的封装剂（11）。还提供了一种封装固态器件的方法。