N₁,N₃-bis(2-hydroxyphenyl)isophthalamide | 15457-49-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N₁,N₃-bis(2-hydroxyphenyl)isophthalamide
• 英文别名: N,N'-Bis(2-hydroxyphenyl)isophthalamide；1-N,3-N-bis(2-hydroxyphenyl)benzene-1,3-dicarboxamide
• CAS: 15457-49-5
• 化学式: C₂₀H₁₆N₂O₄
• 分子量: 348.358
• InChiKey: JRJRREGDBAVNHN-UHFFFAOYSA-N

物化性质

• 沸点：
  433.6±40.0 °C(Predicted)
• 密度：
  1.427±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  26
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  98.7
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  N₁,N₃-bis(2-hydroxyphenyl)isophthalamide 在 sodium tetrahydroborate 作用下， 以 甲醇 、 乙酸乙酯 为溶剂， 反应 6.0h， 以85%的产率得到3-phenyl-3,4-dihydro-2H-benzo[e][1,3]oxazin-6-amine
  参考文献：
  名称：

  苯并恶唑树脂：通过智能苯并恶嗪树脂的新型热固性聚合物

  摘要：

  在众多已知的高性能聚合物中，聚苯并恶唑（PBO）作为最耐热的多杂环聚合物已占据突出的位置。但是，PBO已在相当有限的各种技术中找到了应用，这些技术主要以纤维的形式出现。本文中，我们报告了我们的开创性工作，该工作使用新近开发的智能级苯并恶嗪树脂作为前体，通过新颖的途径生产了交联的聚苯并恶唑。这类苯并恶嗪在一个分子中都具有多种智能功能。最吸引人的特点是它的结构转变成热稳定性更高的交联聚苯并恶唑，而没有传统的聚苯并恶唑合成的有害后果，例如使用聚磷酸作为溶剂。通过这种明智的转换，阻燃的恶唑部分已成功地并入网络结构。这种用于交联聚苯并恶唑的新方法的其他优点包括在分子设计，成本效益和易加工性方面的出色灵活性。

  DOI：

  10.1021/ma300924s
• 作为产物：
  描述：

  间苯二甲酸 在 氯化亚砜 、 N,N-二甲基乙酰胺 、 三甲胺 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 16.0h， 生成 N₁,N₃-bis(2-hydroxyphenyl)isophthalamide
  参考文献：
  名称：

  How Does the Hydrogen Bonding Interaction Influence the Properties of Polybenzoxazine? An Experimental Study Combined with Computer Simulation

  摘要：

  The formation of intra- or intermolecular hydrogen bonding and their influences on polybenzoxazine's properties were investigated after the model benzoxazine monomers (o-AB-fbz, o-AF-fbz, o-AP-fbz, p-AB-fbz, p-AF-fbz, p-AP-fbz) were synthesized. Because of the different electron-donating abilities of bridging units (benzene, furan and pyridine) in isophthalic acid (IPA), 2,5-furandicarboxylic acid (2,5-FDCA) and 2,6-pyridinedicarboxylic acid (2,6-PDCA), the strength of intramolecular H-bonding involved with the oxygen atom in oxazine ring in o-AB-fbz, o-AF-fbz and o-AP-fbz followed the order of o-AB-fbz > o-AF-fbz > o-AP-fbz, and the strength of the overall H-bonding was arranged as follows: o-AB-fbz < o-AF-fbz < oAP-fbz. While more intermolecular H-bonding was formed in p-AB-fbz and p-AF-fbz as well as p-AP-fbz. DSC and FT-IR results discovered the relationship between the H-bonding involved with the oxygen atom in oxazine ring and the curing activities of benzoxazines. After curing reaction, the cured systems showed varied glass transition temperature (Tg), and the influence of H-bonding on Tg was revealed by in situ FT-IR analysis. Molecular dynamics (MD) simulation was also applied to investigate the properties of synthesized polybenzoxazines and similar results were obtained. Not only the formation of H-bonding but also their effects on both the curing behaviors of benzoxazine monomers and the thermal properties of cured resins were systematically investigated, which would help us understand polybenzoxazines more deeply and might be a guideline for improving their comprehensive properties only by manipulating the H-bonding.

  DOI：

  10.1021/acs.macromol.8b00741

文献信息

• (Meth) acrylamide derivative, polymer, chemically amplified photosensitive resin composition, and patterning method
  申请人：Maeda Katsumi

  公开号：US20090068587A1

  公开（公告）日：2009-03-12

  The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R 1 represents a hydrogen atom or a methyl group; R 2 represents an acid-decomposable group; and R 3 to R 6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.

  本发明涉及一种由通式（1）表示的新型（甲基）丙烯酰胺化合物，该化合物的（共）聚合物，以及由聚合物和光酸发生剂组成的化学增感光敏树脂组合物。在该式中，R1代表氢原子或甲基基团；R2代表可分解酸基团；R3至R6独立地代表氢原子、卤素原子或具有1至4个碳原子的烷基基团。
• (Meth)acrylamide derivative, polymer, chemically amplified photosensitive resin composition, and patterning method
  申请人：NEC Corporation

  公开号：US07939241B2

  公开（公告）日：2011-05-10

  The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an acid-decomposable group; and R3 to R6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.

  本发明涉及一种由通式（1）表示的新型（甲基）丙烯酰胺化合物，（甲基）丙烯酰胺化合物的（共）聚合物以及由该聚合物和光酸发生剂组成的化学放大光敏树脂组合物。在该式中，R1表示氢原子或甲基基团；R2表示可酸分解基团；R3到R6独立地表示1至4个碳原子的氢原子、卤素原子或烷基基团。
• POSITIVE-TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, AND PATTERN FORMING METHOD USING SAME
  申请人：Maeda Katsumi

  公开号：US20120021357A1

  公开（公告）日：2012-01-26

  A photosensitive insulating resin composition, comprising a polymer, a photosensitizer, and an amide derivative that is expressed by the following general formula (1); (in formula (1), R 1 represents a bivalent alkyl group, R 2 represents a hydrocarbon group with a carbon number of 1 to 10, and R 3 represents a hydrogen atom or an alkyl group with a carbon number of 1 to 4.)

  一种光敏绝缘树脂组合物，包括聚合物、光敏剂和由下列通式（1）表示的酰胺衍生物；（在式（1）中，R1代表双价烷基，R2代表碳数为1至10的碳氢基团，R3代表氢原子或碳数为1至4的烷基基团。）
• PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1909142A1

  公开（公告）日：2008-04-09

  The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.

  本发明提供了一种光敏树脂组合物，它包含(a)碱溶性树脂，(b)具有仲芳香族氨基和烷氧基的硅化合物，以及(c)至少一种选自光聚合引发剂、光酸发生剂和光碱发生剂的物质。根据本发明，可以获得一种光敏树脂组合物，它在固化后可显著提高与基底的粘合性，而不会降低溶液的储存稳定性，即使在显影后也不会导致精细图案剥离。
• Construction of brick/mortar-like graphene/thermoset composites with highly anisotropic thermal conductivity and strong electromagnetic interference shielding performance
  作者：Zhenhao Yao、Jianan Song、Yin Lu、Rui Yang、Yuan Zhang、Kan Zhang

  DOI：10.1039/d4ta00385c

  日期：——

  and miniaturized electronic components requires the simplified production of high-performance and versatile nanocomposites. Herein a novel approach for obtaining graphene/thermoset composites with switchable properties was proposed via smart structural rearrangement of graphene/thermosetting resin hybrids. Specifically, highly oriented layered graphene composite sheets were successfully constructed

  对集成和小型化电子元件日益增长的需求需要简化高性能和多功能纳米复合材料的生产。本文提出了一种通过石墨烯/热固性树脂混合物的智能结构重排获得具有可切换性能的石墨烯/热固性复合材料的新方法。具体而言，采用真空辅助自组装方法成功构建了高度取向的层状石墨烯复合材料片。此外，合成了酰胺和呋喃官能的苯并恶嗪树脂，并将其用作层间粘合剂，用于加固砖/砂浆状石墨烯/热固性复合材料。额外的热处理促进了聚苯并恶嗪化学转化为聚苯并恶唑网络，这显着增强了聚合物基质和石墨烯纳米片之间的界面相互作用。值得注意的是，新获得的砖/砂浆状石墨烯/热固性复合材料表现出极高的导热率（47.8 W m -1 K -1）、卓越的韧性和出色的电磁屏蔽效能（48.4 dB），这表明它们在电子、军事、航空航天等领域。