2-Methyl-4-oxatricyclo[5.2.1.02,6]decane-3,5-dione | 39973-36-9

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 异戊烯醇脂质
• 英文名称: 2-Methyl-4-oxatricyclo[5.2.1.02,6]decane-3,5-dione
• CAS: 39973-36-9
• 化学式: C₁₀H₁₂O₃
• 分子量: 180.2
• InChiKey: KURYGOWCQOQZRG-UHFFFAOYSA-N

文献信息

• GLASS FIBER-SILSESQUIOXANE COMPOSITE MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
  申请人：Ikeno Hironori

  公开号：US20120052296A1

  公开（公告）日：2012-03-01

  Disclosed is a glass fiber-silsesquioxane composite molded article containing glass fibers and a cured material of a silsesquioxane polymer composited therewith, wherein the silsesquioxane has a polyhedral structure or a partially polyhedral structure. The glass fiber-silsesquioxane composite molded article is preferably obtained by impregnating glass fibers with a composition containing at least one of silsesquioxanes represented by formula (A-1) to (A-3) and at least one of a curing agent, a polymerization initiator, and a hydrosilylation catalyst, or the silsesquioxane polymer and allowing a curing reaction to proceed.

  本发明公开了一种玻璃纤维-硅氧烷复合成型制品，其中包含玻璃纤维和与其复合的硅氧烷聚合物的固化物，所述硅氧烷具有多面体结构或部分多面体结构。最好是通过将玻璃纤维浸渍在含有至少一种由式（A-1）到（A-3）表示的硅氧烷和至少一种固化剂，聚合引发剂和氢化硅催化剂之一的组合物中，并允许固化反应进行来获得玻璃纤维-硅氧烷复合成型制品。
• CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION
  申请人：Kashio Mikihiro

  公开号：US20130035455A1

  公开（公告）日：2013-02-07

  A curable composition that includes (A) a silane compound copolymer that includes a specific repeating unit, (B) a silane coupling agent having a reactive cyclic ether structure, and (C) a curing agent so that the mass ratio “(A):((B)+(C))” of the silane compound copolymer (A) to the silane coupling agent (B) and the curing agent (C) in total is 95:5 to 70:30, a cured product obtained by curing the curable composition, and method for using of the curable composition as an optical device-securing adhesive or an optical device sealing material, are disclosed. The curable composition produces a cured product that does not show coloration (i.e., does not show a deterioration in transparency) even when exposed to high-energy light or subjected to a high temperature, exhibits excellent transparency for a long time, and has high adhesion even at a high temperature. The curable composition may be used to form an optical device-securing material, and may suitably be used as an optical device-securing adhesive or an optical device sealing material.

  本发明公开了一种可治愈组合物，包括（A）一种包含特定重复单元的硅烷化合物共聚物，（B）具有反应性环氧结构的硅烷偶联剂和（C）固化剂，使得硅烷化合物共聚物（A）与硅烷偶联剂（B）和固化剂（C）的质量比“(A)：（（B）+（C））”总和为95:5至70:30。本发明还公开了通过固化可治愈组合物获得的固化产品，以及将可治愈组合物用作光学器件固定粘合剂或光学器件密封材料的方法。该可治愈组合物产生的固化产品即使暴露于高能光或高温下也不会出现着色（即不会出现透明度的恶化），长时间保持优异的透明度，并且即使在高温下也具有高粘附性。该可治愈组合物可用于形成光学器件固定材料，并可适当地用作光学器件固定粘合剂或光学器件密封材料。
• RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ENCAPSULATION
  申请人：Sumitomo Chemical Company, Limited

  公开号：EP1426394A1

  公开（公告）日：2004-06-09

  A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B): (A): a (meth)acrylic polymer containing an epoxy group, and (B): at least one hardener selected from the group consisting of the following components (b1) to (b4): (b1) a polyvalent carboxylic acid, (b2) a polyvalent carboxylic anhydride, (b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and (b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2) wherein R1 to R6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3 and R4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1 to R7 may be substituted by an ether group and/or carbonyl group; Y1 and Y2 represent each independently an oxygen atom, or sulfur atom, is provided.

  一种光半导体封装树脂组合物，具有优异的透光性、抗紫外线性和耐热性，由以下组分（A）和组分（B）组成： (A) 含有环氧基团的（甲基）丙烯酸聚合物，和 (B) 至少一种固化剂，选自以下组份 (b1) 至 (b4)： (b1) 多价羧酸、 (b2) 多价羧酸酐、 (b3) 多价羧酸与下述通式（B-1）化合物的反应产物，和 (b4) 多价羧酸酐与下式通式（B-2）化合物的反应产物 其中 R1 至 R6 各自独立地代表氢原子或具有 1 至 8 个碳原子的烷基，R3 和 R4 可键合形成具有 1 至 8 个碳原子的亚烷基；R7 代表亚烷基；R1 至 R7 所代表的亚烷基和烷基中所含的亚甲基可被醚基和/或羰基取代；Y1 和 Y2 各自独立地代表氧原子或硫原子。
• THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2017295A1

  公开（公告）日：2009-01-21

  To provide a thermosetting composition for an optical semiconductor which is highly transparent, is free-from decrease in thickness or discoloration of a cured product due to heat generation or light emitting of a light emitting device, is superior in heat resistance and lightfastness, and has excellent adhesion to a housing material or the like, a sealing agent for an optical semiconductor device and a die bond material for an optical semiconductor device using the same, and an optical semiconductor device obtained by using the thermosetting composition for an optical semiconductor, the sealing agent for an optical semiconductor, the die bond material for an optical semiconductor device and/or the underfill material for an optical semiconductor device. A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2), the content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol%:         [formula 1] (R1R2SiO2/2)     (1) and         [formula 2] (R3SiO3/2)     (2) in the formula (1) and (2), at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof and they may be the same or may be different from one another and plural types of R1, R2 and R3 different from each other in a repeating unit in a silicone resin skeleton may be contained.

  提供一种光学半导体用热固性组合物，该组合物具有高透明性，不会因发光器件发热或发光而导致固化物厚度减少或变色，具有优异的耐热性和耐光性，并且与外壳材料等具有优异的粘合性、光半导体器件用密封剂和使用该密封剂的光半导体器件用芯片结合材料，以及通过使用光半导体用热固性组合物、光半导体用密封剂、光半导体器件用芯片结合材料和/或光半导体器件用底部填充材料而获得的光半导体器件。 一种用于光学半导体的热固性组合物，含有一种具有含环醚基团的硅树脂和一种能与所述含环醚基团反应的热固剂，其中硅树脂的主要成分是下式（1）表示的结构单元和下式（2）表示的结构单元，下式（1）表示的结构单元的含量为 0.当所含结构单元总数为 1 时，式（1）表示的结构单元的含量为 0.6 至 0.95（摩尔基），式（2）表示的结构单元的含量为 0.05 至 0.4（摩尔基），含环醚基团的含量为 5 至 40 摩尔%： [式 1] (R1R2SiO2/2) (1) 和 [式 2] (R3SiO3/2) (2) 在式(1)和(2)中，R1、R2 和 R3 中至少有一个代表含环醚基团，R1、R2 和 R3 除代表含环醚基团外，还代表具有 1 至 8 个碳原子的烃或其氟化物，它们可以相同，也可以互不相同，在硅树脂骨架的重复单元中可以包含互不相同的多种类型的 R1、R2 和 R3。
• Resin composition for encapsulating optical semiconductor element
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP2151460A1

  公开（公告）日：2010-02-10

  A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

  一种用于封装光学半导体元件的树脂组合物，由下述组分(A)、(B)和(C)组成： (A) 支链硅树脂，每分子含有 2 至 6 个环氧基团、一个或多个(R1SiO3/2)单元、 两个或多个(R2R3SiO)n 结构和 3 个或多个(R43-xR5xSiO1/2)单元，重量份数为 100 份，其中 R1、R2、R3、R4 和 R5 各代表一个氢原子、一个羟基或一个 1 至 20 个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子、(B) 一种固化剂，其用量应使组分 (B) 中环氧活性基团的含量为 0.(C) 一种固化催化剂，其用量范围为每 100 份重量的组分(A)和组分(B)的混合物中含 0.01 至 3 份(重量)。