Active-light-sensitive or radiation-sensitive resin composition, active-light-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device
申请人:FUJIFILM Corporation
公开号:US10423068B2
公开(公告)日:2019-09-24
Provided are an active-light-sensitive or radiation-sensitive resin composition in which the sensitivity is excellent, and an active-light-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the active-light-sensitive or radiation-sensitive resin composition. The active-light-sensitive or radiation-sensitive resin composition contains a resin (Ab) whose polarity is changed by the action of an acid, and a compound that generates an acid upon irradiation with active light or radiation, in which the resin (Ab) includes a metal ion, and the metal type of the metal ion is at least one of metal types belonging to Groups 1 to 10 and 13 to 16 (here, excluding Mg and Cs).
本发明提供了一种灵敏度极佳的主动感光或辐射敏感树脂组合物,以及使用该主动感光或辐射敏感树脂组合物的主动感光或辐射敏感胶片、图案形成方法和电子设备制造方法。主动感光或辐射敏感树脂组合物包含一种在酸作用下极性改变的树脂(Ab)和一种在主动光或辐射照射下产生酸的化合物,其中树脂(Ab)包括金属离子,金属离子的金属类型至少是属于第 1 至 10 组和第 13 至 16 组(此处不包括 Mg 和 Cs)的金属类型之一。