[EN] LOW TEMPERATURE BONDING ADHESIVE COMPOSITION<br/>[FR] COMPOSITION ADHESIVE DURCISSANT A BASSE TEMPERATURE
申请人:DUREZ CORP
公开号:WO2002026888A2
公开(公告)日:2002-04-04
An adhesive composition that bonds at low temperatures is disclosed. The composition is a solution in an organic solvent of a polymide, an epoxy resin, and a cyanate. The polyimide can be a polyimidesiloxane, made from a dianhydride, an aromatic diamine that does not contain siloxane, and a siloxane diamine. The adhesive composition can be used to make a single layer tape, a coated tape, or a double-sided trilayer tape. The tape can bond an article, such as a chip, to a substrate, such as a circuit board.