An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.
一种环氧
树脂组合物,其主要成分包括:(i) 分子中含有至少两个环氧基团的化合物;(ii) 含有
芴骨架的
硅改性
酚醛
树脂作为固化剂;(iii) 有机
磷化合物、胺化合物或
咪唑化合物作为固化
促进剂,可固化成具有低弹性、韧性和低介电性能的弹性体产品。