1-phenyl-5-(thiophen-2-yl)-1H-tetrazole | 1189260-03-4

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 1-phenyl-5-(thiophen-2-yl)-1H-tetrazole
• 英文别名: 1-Phenyl-5-thiophen-2-yltetrazole
• CAS: 1189260-03-4
• 化学式: C₁₁H₈N₄S
• 分子量: 228.277
• InChiKey: CFWBDCXYOOXRJL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  16
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  71.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  N-苯基噻吩-2-甲酰胺 在 三氟甲磺酸酐 、 叠氮基三甲基硅烷 、 sodium carbonate 作用下， 以 二氯甲烷 为溶剂， 反应 20.33h， 以88%的产率得到1-phenyl-5-(thiophen-2-yl)-1H-tetrazole
  参考文献：
  名称：

  通过C–C键裂解实现酰胺的无过渡金属多硝化：四唑的新方法†

  摘要：

  开发了一种无金属的全新的一锅多酰胺酰胺，用于化学和区域选择性合成1,5-二取代的四唑。通过亲电酰胺的活化，以及进一步的C–C键裂解和重排，在温和条件下选择性地构建了多种功能化的1,5-DST衍生物。如机理所示，通过选择反应中的起始原料可以容易地切换化学选择性。

  DOI：

  10.1039/c8cc06324a

文献信息

• Transition-metal-free multinitrogenation of amides by C–C bond cleavage: a new approach to tetrazoles
  作者：Lian-Hua Li、Zhi-Jie Niu、Ying-Xiu Li、Yong-Min Liang

  DOI：10.1039/c8cc06324a

  日期：——

  regioselective synthesis of 1,5-disubstituted tetrazoles has been developed. By means of electrophilic amide activation, and further C–C bond cleavage and rearrangement, a diverse set of functionalized 1,5-DST derivatives were selectively constructed under mild conditions. As showcased in the mechanisms, the chemoselectivity is easily switched by the selection of the starting materials in the reaction.

  开发了一种无金属的全新的一锅多酰胺酰胺，用于化学和区域选择性合成1,5-二取代的四唑。通过亲电酰胺的活化，以及进一步的C–C键裂解和重排，在温和条件下选择性地构建了多种功能化的1,5-DST衍生物。如机理所示，通过选择反应中的起始原料可以容易地切换化学选择性。
• Synthesis of 1,5-disubstituted tetrazoles via Suzuki–Miyaura cross-coupling of 5-chloro-1-phenyltetrazole
  作者：Qing Tang、Ryan Gianatassio

  DOI：10.1016/j.tetlet.2010.04.091

  日期：2010.7

  Suzuki–Miyaura coupling reactions of 5-chloro-1-phenyl-tetrazole with various functionalized arylboronic acids were investigated. In the presence of catalytic amounts of SPhos/Pd(OAc)2 or RuPhos/Pd(OAc)2, the reaction proceeded smoothly to afford 1,5-diaryltetrazoles in good to excellent yields.

  研究了5-氯-1-苯基-四唑与各种官能化的芳基硼酸的Suzuki-Miyaura偶联反应。在催化量的SPhos / Pd（OAc）2或RuPhos / Pd（OAc）2的存在下，反应平稳进行，以良好的产率至优异的产率得到1，5-二芳基四唑。
• Direct C−H Arylation and Alkenylation of 1-Substituted Tetrazoles: Phosphine As Stabilizing Factor
  作者：Marcel Špulák、Richard Lubojacký、Petr Šenel、Jiří Kuneš、Milan Pour

  DOI：10.1021/jo902180u

  日期：2010.1.1

  Direct arylation and alkenylation of 1-substituted tetrazoles was achieved via Pd catalysis in the presence of CuI and CS2CO3. Unlike the related reactions of imidazoles and purines, phosphine ligand was necessary to prevent the intermediate tetrazolyl-Pd-II species from fragmentation into the corresponding cyanamide, Various 1,5-disubstituted tetrazoles were prepared with good to excellent isolated yields.
• Novel chemical composition to reduce defects
  申请人：Buehler F. Mark

  公开号：US20070228011A1

  公开（公告）日：2007-10-04

  A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.
• [EN] A NOVEL CHEMICAL COMPOSITION TO REDUCE DEFECTS<br/>[FR] Nouvelle composition chimique permettant de réduire les défauts
  申请人：INTEL CORP

  公开号：WO2007117395A1

  公开（公告）日：2007-10-18

  [EN] A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant- to- inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.
  [FR] L'invention concerne une composition chimique et des procédés permettant d'éliminer les défauts tout en assurant la protection contre la corrosion de conducteurs sur un substrat. La composition comprend une solution conductrice, un inhibiteur de corrosion et un tensioactif. Le rapport tensioactif/inhibiteur dans la composition est une fonction d'un métal. Le tensioactif est un tensioactif anionique, un tensioactif non ionique ou toute combinaison de ceux-ci. La concentration de l'inhibiteur de corrosion dans la composition chimique peut être faible. L'inhibiteur de corrosion peut former des liaisons faibles avec un matériau conducteur. La solution conductrice peut être une solution de force ionique élevée. La composition est appliquée à une tranche dotée de conducteurs sur un substrat. Au moins deux conducteurs sur le substrat se situent à des potentiels différents. La composition peut être utilisée pour nettoyer la tranche après formation des conducteurs sur le substrat. La composition peut aussi être utilisée pour un polissage mécanilo-chimique de la tranche.