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1-phenyl-5-(thiophen-2-yl)-1H-tetrazole | 1189260-03-4

中文名称
——
中文别名
——
英文名称
1-phenyl-5-(thiophen-2-yl)-1H-tetrazole
英文别名
1-Phenyl-5-thiophen-2-yltetrazole
1-phenyl-5-(thiophen-2-yl)-1H-tetrazole化学式
CAS
1189260-03-4
化学式
C11H8N4S
mdl
——
分子量
228.277
InChiKey
CFWBDCXYOOXRJL-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.6
  • 重原子数:
    16
  • 可旋转键数:
    2
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    71.8
  • 氢给体数:
    0
  • 氢受体数:
    4

反应信息

  • 作为产物:
    描述:
    N-苯基噻吩-2-甲酰胺三氟甲磺酸酐叠氮基三甲基硅烷sodium carbonate 作用下, 以 二氯甲烷 为溶剂, 反应 20.33h, 以88%的产率得到1-phenyl-5-(thiophen-2-yl)-1H-tetrazole
    参考文献:
    名称:
    通过C–C键裂解实现酰胺的无过渡金属多硝化:四唑的新方法†
    摘要:
    开发了一种无金属的全新的一锅多酰胺酰胺,用于化学和区域选择性合成1,5-二取代的四唑。通过亲电酰胺的活化,以及进一步的C–C键裂解和重排,在温和条件下选择性地构建了多种功能化的1,5-DST衍生物。如机理所示,通过选择反应中的起始原料可以容易地切换化学选择性。
    DOI:
    10.1039/c8cc06324a
点击查看最新优质反应信息

文献信息

  • Synthesis, biological evaluation and in silico studies of tetrazole-heterocycle hybrids
    作者:Rajendran Sribalan、Govindharasu Banuppriya、Maruthan Kirubavathi、Vediappen Padmini
    DOI:10.1016/j.molstruc.2018.07.114
    日期:2019.1
    such as thiophene, pyridine and quinoline tetrazoles were synthesized and characterized for the purpose to develop new lead molecules. Biological evaluations such as in vitro antimicrobial and anti-inflammatory activities were studied. Further, the in silico studies such as Molecular docking (with COX-1, COX-2 and 3TTZ), DFT calculations, the Molecular electrostatic potential (MEP) and ADME were investigated
    摘要 为了开发新的先导分子,合成并表征了噻吩吡啶喹啉四唑四唑杂环杂化物的三种不同化学实体。研究了生物学评价,例如体外抗微生物和抗炎活性。此外,还研究了诸如分子对接(使用 COX-1、COX-2 和 3TTZ)、DFT 计算、分子静电势 (MEP) 和 ADME 等计算机研究。
  • Synthesis of 1,5-disubstituted tetrazoles via Suzuki–Miyaura cross-coupling of 5-chloro-1-phenyltetrazole
    作者:Qing Tang、Ryan Gianatassio
    DOI:10.1016/j.tetlet.2010.04.091
    日期:2010.7
    Suzuki–Miyaura coupling reactions of 5-chloro-1-phenyl-tetrazole with various functionalized arylboronic acids were investigated. In the presence of catalytic amounts of SPhos/Pd(OAc)2 or RuPhos/Pd(OAc)2, the reaction proceeded smoothly to afford 1,5-diaryltetrazoles in good to excellent yields.
    研究了5--1-苯基-四唑与各种官能化的芳基硼酸的Suzuki-Miyaura偶联反应。在催化量的SPhos / Pd(OAc)2或RuPhos / Pd(OAc)2的存在下,反应平稳进行,以良好的产率至优异的产率得到1,5-二芳基四唑
  • Direct C−H Arylation and Alkenylation of 1-Substituted Tetrazoles: Phosphine As Stabilizing Factor
    作者:Marcel Špulák、Richard Lubojacký、Petr Šenel、Jiří Kuneš、Milan Pour
    DOI:10.1021/jo902180u
    日期:2010.1.1
    Direct arylation and alkenylation of 1-substituted tetrazoles was achieved via Pd catalysis in the presence of CuI and CS2CO3. Unlike the related reactions of imidazoles and purines, phosphine ligand was necessary to prevent the intermediate tetrazolyl-Pd-II species from fragmentation into the corresponding cyanamide, Various 1,5-disubstituted tetrazoles were prepared with good to excellent isolated yields.
  • Novel chemical composition to reduce defects
    申请人:Buehler F. Mark
    公开号:US20070228011A1
    公开(公告)日:2007-10-04
    A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant-to-inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.
  • [EN] A NOVEL CHEMICAL COMPOSITION TO REDUCE DEFECTS<br/>[FR] Nouvelle composition chimique permettant de réduire les défauts
    申请人:INTEL CORP
    公开号:WO2007117395A1
    公开(公告)日:2007-10-18
    [EN] A chemical composition and methods to remove defects while maintaining corrosion protection of conductors on a substrate are described. The composition includes a conductive solution, a corrosion inhibitor; and a surfactant. A surfactant- to- inhibitor ratio in the composition is a function of a metal. The surfactant is an anionic surfactant, a non-ionic surfactant, or any combination thereof. The concentration of the corrosion inhibitor in the chemical composition can be low. The corrosion inhibitor can form soft bonds with a conductor material. The conductive solution can be a high ionic strength solution. The composition is applied to a wafer having conductors on a substrate. At least two conductors on the substrate have different potentials. The composition can be used to clean the wafer after forming the conductors on the substrate. The composition can be used for chemical mechanical polishing of the wafer.
    [FR] L'invention concerne une composition chimique et des procédés permettant d'éliminer les défauts tout en assurant la protection contre la corrosion de conducteurs sur un substrat. La composition comprend une solution conductrice, un inhibiteur de corrosion et un tensioactif. Le rapport tensioactif/inhibiteur dans la composition est une fonction d'un métal. Le tensioactif est un tensioactif anionique, un tensioactif non ionique ou toute combinaison de ceux-ci. La concentration de l'inhibiteur de corrosion dans la composition chimique peut être faible. L'inhibiteur de corrosion peut former des liaisons faibles avec un matériau conducteur. La solution conductrice peut être une solution de force ionique élevée. La composition est appliquée à une tranche dotée de conducteurs sur un substrat. Au moins deux conducteurs sur le substrat se situent à des potentiels différents. La composition peut être utilisée pour nettoyer la tranche après formation des conducteurs sur le substrat. La composition peut aussi être utilisée pour un polissage mécanilo-chimique de la tranche.
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