5-p-Menthene-1,2-diol

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 异戊烯醇脂质
• 英文名称: 5-p-Menthene-1,2-diol
• 英文别名: 2-methyl-5-propan-2-ylcyclohex-3-ene-1,2-diol
• 化学式: C₁₀H₁₈O₂
• 分子量: 170.25
• InChiKey: YRHFOCFOBZVGPU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  12
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.8
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS
  申请人：Jin Xin

  公开号：US20130178591A1

  公开（公告）日：2013-07-11

  A poly epoxy ester resin composition of the following chemical structure: where n is a number from 2 to about 3000; each m independently has a value of 0 or 1; each R 0 is independently —H or —CH 3 ; each R 1 is independently —H or a C 1 to C 6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group;_and X is cycloalkylene group, including substituted cycloalkylene group, where the substitute group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substitute group, for example, a halogen, a nitro, a blocked isocyanate, or an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

  以下是化学结构式为的聚合物环氧酯树脂组成：其中n为2至约3000的数字；每个m独立地具有值为0或1；每个R0独立地为—H或—CH3；每个R1独立地为—H或C1到C6的烷基基团（饱和二价脂肪族碳氢基团），Ar为二价芳基基团或杂芳基基团；X为环烷基团，包括取代环烷基团，其中取代基团包括烷基、环烷基、芳基或芳基烷基团或其他取代基团，例如卤素、硝基、阻塞异氰酸酯或烷氧基团；环烷基和烷基团的组合以及烷基和环烷基团之间带有桥接基团。
• THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM
  申请人：Blue Cube IP LLC

  公开号：EP2621990B1

  公开（公告）日：2016-02-24
• EPOXY RESIN COMPOSITIONS
  申请人：Dow Global Technologies LLC

  公开号：EP2621994A1

  公开（公告）日：2013-08-07
• ADVANCED EPOXY RESIN COMPOSITIONS
  申请人：Dow Global Technologies LLC

  公开号：EP2621995A1

  公开（公告）日：2013-08-07
• DISULFIDE STABILIZED DVD-IG MOLECULES
  申请人：Heywood Sam Philip

  公开号：US20130302336A1

  公开（公告）日：2013-11-14

  A re-epoxidized polyfunctional epoxy resin composition comprising the reaction product of: (I) an epoxidized polyfunctional epoxy resin oligomeric composition comprising a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of: (i) an aliphatic or cycloaliphatic hydroxyl-containing material; (ii) an epihalohydrin, (iii) a basic-acting substance, in the presence of (iv) a non-Lewis acid catalyst; and (v) optionally, one or more solvents; (II) an epihalohydrin; (III) a basic acting substance; in the presence of (IV) a non-Lewis acid catalyst; and (V) optionally, one or more solvents. A curable epoxy resin composition of the re-epoxidized polyfunctional epoxy resin composition and a thermoset of the curable composition is also disclosed.