申请人:Asahi Kasei Chemicals Corporation
公开号:EP2508545A1
公开(公告)日:2012-10-10
A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula a (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, R1 independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, R2 represents an epoxy group-containing organic group, R3 represents R1 or R2, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3), Y represents -o- or a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), R1 in the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.]
一种热固性树脂组合物,其基本成分(A)为含有通式 a(1)或(2)所代表化合物的有机聚硅氧烷,以及使用该组合物的光学半导体外围材料。[这里,在通式中,R1 独立地代表碳原子数为 1-10 的取代或非取代的一价烃基,R2 代表含环氧基的有机基团,R3 代表 R1 或 R2,a 独立地代表 2 以上的整数,b 独立地代表 0 以上的整数、X 代表通式 (3),Y 代表-o-或碳原子数为 1-6 的二价烃基,Z 代表下式 (4),式中的 R1 独立地代表碳原子数为 1-10 的取代或非取代的一价烃基,c 代表 0 或以上的整数。]