申请人:HENKEL LOCTITE CORPORATION
公开号:US20040102566A1
公开(公告)日:2004-05-27
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
本发明涉及可分级的芯片连接粘合剂、制备此类粘合剂的方法、将此类粘合剂应用于芯片和其他基板表面的方法,以及用其制备的用于连接微电子电路的组件。