Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US10564543B2
公开(公告)日:2020-02-18
A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R1, R2 and R3 independently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural R1s, R2s, and R3s independently may be the same or different.
一种光敏树脂组合物包括:(A)一种粘合剂聚合物,其结构单元来源于具有 1 至 12 个碳原子的羟基烷基的羟基烷基(甲基)丙烯酸酯和来源于(甲基)丙烯酸的结构单元;(B)一种具有乙烯不饱和键基的可光聚合化合物;(C)一种光聚合引发剂;以及(D)一种由式(1)表示的苯乙烯基吡啶。在式(1)中,R1、R2 和 R3 各自独立地代表具有 1 至 20 个碳原子的烷基、具有 1 至 6 个碳原子的烷氧基、具有 1 至 6 个碳原子的烷基酯基、氨基、具有 1 至 20 个碳原子的烷基氨基、羧基、腈基、硝基、乙酰基或(甲基)丙烯酰基,a、b 和 c 各自独立地代表 0 至 5 的整数。在 a、b 和 c 中的每一个独立地为 2 或更多的情况下,复数 R1s、R2s 和 R3s 可以独立地相同或不同。