Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
申请人:SHENGYI TECHNOLOGY CO., LTD.
公开号:US10400058B2
公开(公告)日:2019-09-03
Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
本发明公开了一种树脂组合物和使用该树脂组合物的预浸料、层压板和覆铜板及其降解方法,该树脂组合物包括:环氧树脂、可降解胺固化剂、可降解硫醇固化剂和无机填料。用该树脂组合物制造的覆铜箔层压板由多块叠放的预浸料和铜箔组成,铜箔布置在叠放预浸料的一侧或两侧,每块预浸料由增强材料组成,树脂组合物经浸泡和干燥后粘附在其上。本发明将可降解胺类固化剂和可降解硫醇类固化剂混合,得到反应速率可调的固化体系,从而便于制造覆铜板层压板时的工艺控制,且制造的覆铜板层压板具有较高的综合性能,可完全降解,从而可回收和重复使用各有效成分。