2,4-Thiazolidinedione, 5-[[4-(1-methylethyl)phenyl]methylene]- | 160579-90-8

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 异戊烯醇脂质
• 英文名称: 2,4-Thiazolidinedione, 5-[[4-(1-methylethyl)phenyl]methylene]-
• 英文别名: 5-[(4-propan-2-ylphenyl)methylidene]-1,3-thiazolidine-2,4-dione
• CAS: 160579-90-8
• 化学式: C₁₃H₁₃NO₂S
• mdl: MFCD00640661
• 分子量: 247.318
• InChiKey: GXIDNNRIWNVXTL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  71.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  2,4-噻唑烷二酮 、 4-异丙基苯甲醛 生成 2,4-Thiazolidinedione, 5-[[4-(1-methylethyl)phenyl]methylene]-
  参考文献：
  名称：

  取代基和溶剂对5-亚芳基-2,4-噻唑烷二酮类化合物分子内电荷转移的影响

  摘要：

  在300至600 nm范围内的二十一种溶剂中记录了十二种5-芳基-2,4-噻唑烷二酮的吸收光谱。通过使用Catalán溶剂参数集来评估特定和非特定溶剂-溶质相互作用对最大吸收位移的影响。此外，借助从头开始的MP2和时间依赖性密度泛函（TD-DFT）方法解释了实验结果。发现不同的取代基显着改变分子中的共轭程度，并进一步影响其分子内电荷转移特性。

  DOI：

  10.1016/j.saa.2011.10.074

文献信息

• Etchant composition
  申请人：LAM RESEARCH AG

  公开号：US11345852B2

  公开（公告）日：2022-05-31

  The present invention relates to an etchant composition, in particular to an aqueous masking layer etchant composition for use in the removal of tungsten-doped carbon masking layers from a surface of a substrate, such as a semiconductor wafer. The composition comprises (a) 10 to 40 wt. %, based on the total weight of the composition, of hydrogen peroxide; and (b) 0.1 to 2.0 wt. %, based on the total weight of the composition, of one or more corrosion inhibitors.

  本发明涉及一种蚀刻剂组合物，尤其涉及一种水性掩蔽层蚀刻剂组合物，用于从基底（如半导体晶片）表面去除掺钨的碳掩蔽层。该组合物包括：(a) 基于组合物总重量的 10 至 40 重量百分比的过氧化氢；和 (b) 基于组合物总重量的 0.1 至 2.0 重量百分比的一种或多种腐蚀抑制剂。
• INHIBITORS OF PIM PROTEIN KINASES, COMPOSITIONS, AND METHODS FOR TREATING CANCER
  申请人：Musc Foundation for Research Development

  公开号：EP2217235A2

  公开（公告）日：2010-08-18
• Polishing systems
  申请人：Misra Sudhanshu

  公开号：US20090318063A1

  公开（公告）日：2009-12-24

  Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced.
• Inhibitors of PIM-1 Protein Kinases, Compositions and Methods for Treating Prostate Cancer
  申请人：Smith Charles D.

  公开号：US20110263664A1

  公开（公告）日：2011-10-27

  The disclosure relates to inhibitors of Pim-1 and/or Pim-2 protein kinase, to compositions comprising one or more inhibitors of Pim-1 and/or Pim-2 protein kinase, and to methods for treating cancer.
• Organic Corrosion Inhibitor-Embedded Polymer Capsule, Preparation Method Thereof, Composition Containing Same, and Surface Treated Steel Sheet Using Same
  申请人：Park Ji Hoon

  公开号：US20130196173A1

  公开（公告）日：2013-08-01

  Provided are a polymer capsule in which an organic corrosion inhibitor is encapsulated, a method of preparing the same, a composition having the same, and a steel sheet whose surface is treated using the same. The polymer capsule prepared to include a core layer polymer having a hydrophilic acid group and at least one shell layer surrounding the core layer through continuous emulsion polymerization may have an organic corrosion inhibitor effectively encapsulated. The corrosion inhibitor may be released from the capsule in a corrosive environment, thereby enhancing corrosion resistance of the steel sheet.