A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):
(A): a (meth)acrylic polymer containing an epoxy group, and
(B): at least one hardener selected from the group consisting of the following components (b1) to (b4):
(b1) a polyvalent carboxylic acid,
(b2) a polyvalent carboxylic anhydride,
(b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and
(b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2)
wherein R1 to R6 represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3 and R4 may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7 represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1 to R7 may be substituted by an ether group and/or carbonyl group; Y1 and Y2 represent each independently an oxygen atom, or sulfur atom, is provided.
一种光半导体封装
树脂组合物,具有优异的透光性、抗紫外线性和耐热性,由以下组分(A)和组分(B)组成:
(A) 含有环氧基团的(甲基)
丙烯酸聚合物,和
(B) 至少一种固化剂,选自以下组份 (b1) 至 (b4):
(b1) 多价
羧酸、
(b2) 多价
羧酸酐、
(b3) 多价
羧酸与下述通式(B-1)化合物的反应产物,和
(b4) 多价
羧酸酐与下式通式(B-2)化合物的反应产物
其中 R1 至 R6 各自独立地代表氢原子或具有 1 至 8 个碳原子的烷基,R3 和 R4 可键合形成具有 1 至 8 个碳原子的亚烷基;R7 代表亚烷基;R1 至 R7 所代表的亚烷基和烷基中所含的亚甲基可被醚基和/或羰基取代;Y1 和 Y2 各自独立地代表氧原子或
硫原子。