The present invention includes polymers and photoresist compositions that comprise the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-200 nm, particularly 193 nm. Polymers of the invention contain in specified molar ratios both nitrile and photoacid labile groups that have an alicyclic moiety, particularly a bridged bicyclic or tricyclic group or other caged group. Polymers and resists of the invention can exhibit substantial resistance to plasma etchants.
本发明涉及聚合物和光阻组合物,其中聚合物作为
树脂粘合剂组分。本发明的光阻包括
化学增强型正向作用光阻,可在短波长下有效成像,例如亚200纳米,特别是193纳米。本发明的聚合物在指定的摩尔比例下包含腈基和光酸不稳定基团,具有螺环状基团,特别是桥联双环或
三环基团或其他笼状基团。本发明的聚合物和光阻可以表现出对等离子体刻蚀剂的相当抵抗力。