A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.
一种用于半导体基底的清洁组合物含有溶剂和聚合物,聚合物包括
氟原子、
硅原子或它们的组合。溶剂中
水的含量最好不超过 20%(质量百分比)。清洗组合物最好还含有一种非聚合酸的有机酸。有机酸最好是多氢
羧酸。聚合物的酸解离常数最好小于有机酸的酸解离常数。有机酸在 25 摄氏度的
水中的溶解度最好不低于 5%(质量分数)。有机酸在 25 摄氏度时最好是固体。