2-Ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2-Ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione
• 英文别名: 2-ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione
• 化学式: C₈H₁₂O₄
• 分子量: 172.18
• InChiKey: UQJQLWITIYNEJO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  12
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.75
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  2-Ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione 、 8-Methyl-6,10-dioxaspiro[4,5]decane-7,9-dione 以to obtain 80 g of 8,8-dimethyl-6,10-dioxaspiro[4,5]decane-7,9-dione的产率得到8,8-Dimethyl-6,10-dioxaspiro[4,5]decane-7,9-dione
  参考文献：
  名称：

  ADHESIVE RESIN COMPOSITION, LAMINATE, AND SELF-STRIPPING METHOD

  摘要：

  本发明的粘合树脂组合物包括一种可膨胀的黏性聚合物，其结构源自Meldrum酸衍生物，或由以下通式（1）表示的Meldrum酸衍生物和粘合树脂组成。

  公开号：

  US20140322474A1
• 作为产物：
  描述：

  甲基丙二酸 、 乙酸酐 、 丁酮 、 乙酸乙酯 在 硫酸 作用下， 以 水 为溶剂， 反应 25.0h， 以obtaining 75 g of 2-ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione的产率得到2-Ethyl-2,5-dimethyl-1,3-dioxane-4,6-dione
  参考文献：
  名称：

  METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE

  摘要：

  本发明提供了一种从层压结构中剥离电子元件的方法，该层压结构由电子元件通过具有自剥离粘合层的粘合膜粘合在支撑基板上的定义位置，具有暴露区域A。该方法包括以下步骤：通过在区域A上施加能量来减少支撑基板和自剥离粘合层之间的粘合强度；通过进一步施加能量从支撑基板上移除层压结构，并从支撑基板和自剥离粘合层之间的起始点进一步减小粘合强度；通过从电子元件上移除粘合膜来剥离电子元件。

  公开号：

  US20160141197A1

文献信息

• ADHESIVE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：MITSUI CHEMICALS TOHCELLO, INC.

  公开号：US20160208144A1

  公开（公告）日：2016-07-21

  An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.

  本发明的粘合膜包括基材层和自剥离粘合层层压在其中。基材层在流向方向上具有热收缩百分比（MD方向的热收缩百分比）和与流向方向垂直的方向上的热收缩百分比（TD方向的热收缩百分比），满足以下条件：（1）在150℃加热30分钟后，0.4≦|MD方向热收缩百分比/TD方向热收缩百分比|≦2.5，MD方向热收缩百分比和TD方向热收缩百分比的平均值≦2％；（2）在200℃加热10分钟后，0.4≦|MD方向热收缩百分比/TD方向热收缩百分比|≦2.5，MD方向热收缩百分比和TD方向热收缩百分比的平均值≧3％。
• ADHESIVE RESIN COMPOSITION, LAMINATE BODY, AND SELF-PEELING METHOD
  申请人：Mitsui Chemicals Tohcello Co., Ltd.

  公开号：EP2792725A1

  公开（公告）日：2014-10-22

  An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

  本发明的粘合剂树脂组合物包括一种可膨胀的粘性聚合物，其结构来源于梅尔德伦酸衍生物，或由以下通式（1）表示的梅尔德伦酸衍生物和一种粘合剂树脂。
• ELECTRONIC MEMBER PEELING METHOD AND LAMINATED BODY
  申请人：Mitsui Chemicals Tohcello, Inc.

  公开号：EP3007211A1

  公开（公告）日：2016-04-13

  Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).

  提供了一种从层压板（10）上剥离电子元件（16）的方法，层压板（10）由电子元件（16）组成，电子元件（16）通过粘合膜（14）粘附在支撑基板（12）上，粘合膜（14）在位于支撑基板（12）一侧的表面上具有自剥离粘合层（17），在位于电子元件（16）一侧的表面（14a）的至少一部分上具有暴露区域 A。该方法包括通过在区域 A 上施加能量，降低支撑基板 (12) 与区域 A 中的自剥离粘合剂层 (17) 之间的粘合强度的步骤；通过进一步在该区域上施加能量，从而从支撑基板 (a) 和自剥离粘合剂层之间的界面起点进一步降低在前一步骤中降低的支撑基板 (a) 和自剥离粘合剂层之间的粘合强度，将支撑基板 (a) 从层压板上移除的步骤；以及通过从电子部件 (16) 上移除粘合膜 (14) 将电子部件 (16) 从层压板上剥离的步骤。
• ADHESIVE FILM AND METHOD FOR MANUFACTURING SEMINCONDUCTOR DEVICE
  申请人：Mitsui Chemicals Tohcello, Inc.

  公开号：EP3040390A1

  公开（公告）日：2016-07-06

  An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150°C for 30 minutes, 0.4 ≤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ≤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ≤ 2%, and (2) after heating at 200°C for 10 minutes, 0.4 ≤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ≤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ≥ 3%.

  本发明的胶膜包括基材层和层压在基材层上的自剥离胶层。基材层在流动方向上的热收缩百分比（MD 方向上的热收缩百分比）和在相对于流动方向的正交方向上的热收缩百分比（TD 方向上的热收缩百分比）满足以下条件：(1) 在 150°C 下加热 30 分钟后，0.4 ≤ | MD 方向上的热收缩百分比/TD 方向上的热收缩百分比| ≤ 2.5 且 MD 方向的热收缩百分比和 TD 方向的热收缩百分比的平均值≤ 2%，以及 (2) 在 200°C 下加热 10 分钟后，0.4 ≤ | MD 方向的热收缩百分比/TD 方向的热收缩百分比| ≤ 2.5 且 MD 方向的热收缩百分比和 TD 方向的热收缩百分比的平均值≥ 3%。
• US9611410B2
  申请人：——

  公开号：US9611410B2

  公开（公告）日：2017-04-04