NICKEL COMPOUND AND METHOD OF FORMING THIN FILM USING THE NICKEL COMPOUND
申请人:Samsung Electronics Co., Ltd.
公开号:US20150266913A1
公开(公告)日:2015-09-24
Provided are a heterostructured nickel compound including a nickel amidinate ligand and an aliphatic alkoxy group and a method of forming a thin film including the heterostructured nickel compound. The method includes forming a nickel-containing layer on a substrate by using the heterostructured nickel compound including the nickel amidinate ligand and the aliphatic alkoxy group.