[EN] ORTHOESTER COMPOSITIONS FOR AFFINITY PURIFICATION OF OLIGONUCLEOTIDES [FR] COMPOSITIONS D'ORTHOESTER DESTINÉES À LA PURIFICATION PAR AFFINITÉ D'OLIGONUCLÉOTIDES
Die Verwendung von Polyisocyanatlösungen zur Imprägnierung von mineralischen Substraten
申请人:BAYER AG
公开号:EP0540976A1
公开(公告)日:1993-05-12
Die Verwendung von Lösungen von a) Harnstoffgruppenfreien, fluorenthaltenden Polyisocyanaten in b) gegenüber Isocyanatgruppen inerten Lösungsmitteln zur Imprägnierung von mineralischen Substraten, ausgewählte, hierzu geeignete, fluorenthaltende Polyisocyanate mit einem Fluorgehalt in Form von perfluorierten Alkylgruppen von 15 bis 60 Gew.-% und einem Isocyanatgehalt von 0,5 bis 15 Gew.-%, welche durch Umsetzung von (cyclo)aliphatischen Isocyanaten mit fluoraufweisenden ein- und mehrwertigen Alkoholen hergestellt worden sind, sowie ausgewählte, zur Herstellung derartiger Polyisocyanate geeignete, fluorenthaltende Alkohole.
a) 不含脲基的含氟多异氰酸酯在 b) 对异氰酸酯基团惰性的溶剂中的溶液用于矿物基材的浸渍,适用于这一目的的精选含氟多异氰酸酯,其全氟烷基形式的氟含量为 15 至 60 重量百分比,异氰酸酯含量为 0.5 至 15 重量百分比,是通过(环)脂肪族异氰酸酯与释放氟的一元醇和多元醇反应制得的。此外,还可以通过(环)脂肪族异氰酸酯与释放氟的一元醇和多元醇以及适于制备此类多 异氰酸酯的精选含氟醇反应制备异氰酸酯,其异氰酸酯含量为 0.5%至 15%(重量百分比)。
POLYCARBONATE-BASE POLYMER, PRODUCTION PROCESS, RESIN COATING FLUID PREPARED THEREFROM, AND ELECTROPHOTOGRAPHIC PHOTORECEPTOR PREPARED THEREFROM
申请人:IDEMITSU KOSAN COMPANY LIMITED
公开号:EP0837085A1
公开(公告)日:1998-04-22
A polymer comprising mainly repeating units (1) and/or repeating units (2), containing optionally terminal groups (3) and/or repeating units (4), and having a reduced viscosity [ηsp/c] of 0.2 to 10.0 dl/g as measured in a 0.5 g/dl solution thereof in methylene chloride at 20°C; a resin coating fluid containing the polymer, a charge-transfer substance and a solvent; and an electrophotographic photoreceptor containing the polymer as a binder resin in a photosensitive layer, wherein Rf1 represents a group that is composed of at least carbon atoms and fluorine atoms and bonded directly to the two oxygen atoms of the carbonate linkage in the general formula (1) without any intervening arylene group; and Rf2 represents a group that is composed of at least carbon atoms and fluorine atoms and bonded directly to one of the oxygen atoms of the carbonate linkage in the general formula (3) without any intervening arylene group.
MALEIMIDO-BEARING COMPOUNDS, RESIN COMPOSITIONS CONTAINING THE SAME AND CURED ARTICLES THEREOF
申请人:Nippon Kayaku Kabushiki Kaisha
公开号:EP1460092A1
公开(公告)日:2004-09-22
The present invention provides (meth)acrylate compounds bearing a specific maleimide group and resin compositions containing said compounds that can be cured by irradiation of light in a practical dose even when a photoinitiator is not used or used in a smaller amount than that of the prior art, and cured articles of the resin compositions.
POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3398983A1
公开(公告)日:2018-11-07
This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition.
Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1),
wherein, X1, R1, Z, a repeating number "s", Y1, Rf, a repeating number "n" and "k" represent the same meanings as mentioned in the specification.
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD OF FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP3734362A1
公开(公告)日:2020-11-04
The present invention is a positive photosensitive resin composition comprising: (A-1) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (A-2) a resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, each of which has no alkali-soluble group and contains a heterocyclic skeleton having at least one or more nitrogen atoms at a molecular end; (B) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution; and (D) a solvent. This provides a positive photosensitive resin composition which is soluble in an alkaline aqueous solution, can form a fine pattern and can obtain high resolution, and has excellent mechanical characteristics even when cured at low temperatures.