申请人:SHOWA DENKO K.K.
公开号:US20140309326A1
公开(公告)日:2014-10-16
Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1):
wherein R
1
represents H or CH
3
and R
2
represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2):
wherein R
3
s each independently represent CH
3
or CH
2
CH
3
, and R
4
represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):
本发明提供了一种可聚合化合物、一种光固化组合物和一种用于安装电路板的光固化防潮绝缘涂料材料,其可降低环境影响,在低辐照剂量下具有优异的表面固化性能,并且对基底材料具有高粘附性。根据本发明,该化合物具有源自二元醇二聚体的结构单元,并且具有式(1)所表示的基团作为末端基团。其中,R1表示H或CH3,R2表示具有2到12个碳原子的烃基,在其末端。最好的情况是,该化合物具有式(1)所表示的基团和式(2)所表示的基团作为末端基团。其中,R3分别独立表示CH3或CH2CH3,R4表示具有3到9个碳原子的烃基,在其末端。具有源自二元醇二聚体的结构单元的结构最好用式(3)表示: