It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.
Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.
A water-soluble preflux comprising an imidazole compound and a carboxylic acid compound having 4 to 16 carbon atoms represented by the following general formula 1:
wherein R
1
represents a linear or branched alkyl group having 1 to 4 carbon atoms, R
2
represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents 1 or 2.
本发明的目的是提供一种
水溶性预流体,其中包含一种低挥发性溶剂,其性能优异,能够将
咪唑化合物溶解在
水中,并能够发挥
咪唑化合物的优异成膜性能,同时提供一种
金属导电部件表面处理方法,其包括将表面与上述
水溶性预流体接触。另一个目的是提供一种印制电路板,其中
金属导电部件的表面已与上述
水溶性预流体接触,并提供一种焊接方法,其包括将
金属导电部件的表面与上述
水溶性预流体接触,然后焊接表面。一种
水溶性预流体,包括
咪唑化合物和下述一般式1所表示的具有4至16个碳原子的
羧酸化合物,其中R1表示具有1至4个碳原子的线性或支链烷基,R2表示氢原子或甲基基团,m表示0至3的整数,n表示1或2。