IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS
申请人:Mizori Farhad G.
公开号:US20110130485A1
公开(公告)日:2011-06-02
The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
TRICYCLIC BRIDGED CYCLOPENTANEDIONE DERIVATIVES AS HERBICIDES
申请人:Syngenta Limited
公开号:EP2188294A2
公开(公告)日:2010-05-26
Imide-linked maleimide and polymaleimide compounds
申请人:Mizori G. Farhad
公开号:US20080075961A1
公开(公告)日:2008-03-27
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS
申请人:DESIGNER MOLECULES, INC.
公开号:US20130228901A1
公开(公告)日:2013-09-05
The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.