2-phenylpyrroline

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: 2-phenylpyrroline
• 英文别名: 2-phenyl-2,3-dihydro-1H-pyrrole
• 化学式: C₁₀H₁₁N
• 分子量: 145.204
• InChiKey: SAZABYIAABNOPG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  11
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.2
• 拓扑面积：
  12
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2-phenylpyrroline 在 硼烷 、 溶剂黄146 、 二甲胺 作用下， 反应 4.0h， 生成 2-苯基吡咯烷
  参考文献：
  名称：

  Efficient synthesis of enantiomerically pure thioester precursors of [11C]McN-5652 from racemic McN-5652

  摘要：

  An improved synthesis of the enantiomerically pure thioester precursors of [C-11](+)-McN-5652 ([C-11](+)-1), and [C-11](-)-McN5652 ([C-11](-)-1) starting from racemic McN-5652 ((+/-)-1) is described. The Synthetic method includes the resolution of (+/-)-1 by:repeated crystallization of the (+)- and (-)-di-p-toluoyltartrates yielding (+)-McN-5652 ((+)-1) and (-)-McN-5652 ((-)-1), each with >98% enantiomeric purity. S-Demethylation of (+/-)-1, (+)-1 and (-)-1, respectively was achieved by:treatment with sodium amide at low temperatures (-78 degrees C) followed by conversion of the intermediate thiols 2 with acetyl chloride to give the corresponding thioester precursors (+/-)-3, (+)-3 oy:(-)-3. This demethylation method almost completely suppressed the isomerization of the pharmacologically active trans diastereomer into the inactive cis form. Chiral HPLC analyses confirmed that the S-demethylation proceeded without any racemization. C-11-labelling of(+)-3 or (-)-3 yields :enantiomerically pure [C-11](+)-McN-5652 or [C-11](-)-McN5652, each in 22 % radiochemical yield (decay-corrected, related to [C-11]CO2) and a specific radioactivity of 74 GBq/mu mol (2 Ci/mu mol) at the end of synthesis (EOS).

  DOI：

  10.1002/(sici)1099-1344(19991230)42:13<1301::aid-jlcr298>3.0.co;2-2
• 作为产物：
  描述：

  4-methyl-N-(1-phenylbut-3-yn-1-yl)benzenesulfonamide 在 potassium tert-butylate 、 silver(I) acetate 作用下， 以 二甲基亚砜 、 乙腈 为溶剂， 50.0~80.0 ℃ 、689.49 kPa 条件下， 反应 0.33h， 生成 2-phenylpyrroline
  参考文献：
  名称：

  AgOAc催化的炔丙基胺分子环化反应微波辅助合成二氢吡咯。

  摘要：

  在微波辐射反应条件下，在AgOAc为催化剂存在下，由炔丙基胺的分子内环化反应合成了一系列5-芳基二氢吡咯。在声化学巴比尔型反应条件下，使炔丙基溴与N-甲苯磺酰基亚胺反应，制得炔丙基胺。5-芳基二氢吡咯在KO t Bu / DMSO中的进一步芳构化反应可在微波辐射反应条件下提供2-芳基吡咯。

  DOI：

  10.1007/s11164-016-2442-x

文献信息

• Use of a catalyst in epoxy compositions
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0328020A2

  公开（公告）日：1989-08-16

  Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium compound, non-heterocyclic amine compound, heterocyclic nitrogen compound or salt thereof with an acid or a salt of an acid having a weak nucleophilic anion.

  本发明公开了一种贮存稳定的组合物，该组合物包括一种含环氧化物的化合物、一种含酚羟基的化合物和一种催化环氧化物基团与芳香羟基基团反应的催化剂化合物，该催化剂包括鎓化合物、非杂环胺化合物、杂环氮化合物或其盐与酸或具有弱亲核阴离子的酸的盐接触后产生的产物。
• Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0458502A2

  公开（公告）日：1991-11-27

  In summary, the application is related to the discovery of a class of compounds which comprises boric acid or maleic acid or a mixture of boric acid with at least one acid having a weak nucleophilic anion, which inhibits the reaction of a polyepoxide with a curing agent at low temperatures. In another embodiment the application is a latent catalyst system adapted for curing a polyepoxide resulting from contacting I) a catalyst for the cure of a polyepoxide compound comprising an amine, heterocyclic nitrogen phosphine, sulfide, phosphine, sulfide, ammonium, phosphonium, sulfonium, arsonium, containing compound or a mixture thereof; with II) boric acid, or a mixture of boric acid with at least an acid having a weak nucleophilic anion. Further the application relates to epoxy resin compositions containing the inhibitor or latent catalytic composition. In still another embodiment the application relates to a composition useful for curing a polyepoxide which contains: A) an inhibiting amount of boric acid or maleic acid or a mixture of boric acid with at least one acid having a weak nucleophilic anion; and optionally B) a catalytic amount of a catalyst useful for accelerating the reaction of a polyepoxide with the curing agent, wherein the inhibitor and catalyst may be present in complex form.

  总之，本申请涉及一类化合物的发现，该化合物由硼酸或马来酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物组成，在低温下可抑制聚环氧化物与固化剂的反应。在另一个实施方案中，本申请涉及一种潜伏催化剂系统，该系统适用于固化聚环氧乙烷，该固化聚环氧乙烷化合物的催化剂包括胺、杂环含氮膦、硫化物、膦、硫化物、铵、鏻、锍、胂、含化合物或其混合物；与 I) 硼酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物接触后产生的聚环氧乙烷。此外，本申请还涉及含有抑制剂或潜在催化成分的环氧树脂组合物。在另一个实施方案中，本申请涉及一种用于固化聚环氧树脂的组合物，该组合物含有A) 抑制量的硼酸或马来酸或硼酸与至少一种具有弱亲核阴离子的酸的混合物；以及 B) 催化量的催化剂，用于加速聚环氧化物与固化剂的反应，其中抑制剂和催化剂可以复合物形式存在。
• Catalysts and epoxy resin composition containing the same
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0553887A2

  公开（公告）日：1993-08-04

  Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium compound, non-heterocyclic amine compound, heterocyclic nitrogen compound or salt thereof with an acid or a salt of an acid having a weak nucleophilic anion.

  本发明公开了一种贮存稳定的组合物，该组合物包括一种含环氧化物的化合物、一种含酚羟基的化合物和一种催化环氧化物基团与芳香羟基基团反应的催化剂化合物，该催化剂包括鎓化合物、非杂环胺化合物、杂环氮化合物或其盐与酸或具有弱亲核阴离子的酸的盐接触后产生的产物。
• BENZOXAZINE LOW TEMPERATURE CURABLE COMPOSITION
  申请人：Huntsman Advanced Materials Americas LLC

  公开号：EP3265447A1

  公开（公告）日：2018-01-10
• Benzoxazine Low Temperature Curable Composition
  申请人：Huntsman Advanced Materials Americas LLC

  公开号：US20180030264A1

  公开（公告）日：2018-02-01

  The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.