Isopropylmagnesium chloride-promoted unilateral addition of Grignard reagents to β-diketones: one-pot syntheses of β-tertiary hydroxyl ketones or 3-substituted cyclic-2-enones
作者:Rui Yuan、Dan Zhao、Li-Yuan Zhang、Xiang Pan、Yan Yang、Pei Wang、Hong-Feng Li、Chao-Shan Da
DOI:10.1039/c5ob02072g
日期:——
unilateral additions of Grignardreagents to acyclic or cyclic β-diketones were effectively promoted by sub-stoichiometric amounts of i-PrMgCl to afford β-tertiary hydroxyl ketones or 3-substituted cyclic-2-enones, respectively. Also, the addition of Grignardreagents to acyclic β-diketones followed by a reaction with cyclic β-diketones in a one-pot process was put forward. The reaction mechanism was discussed
Remarkable Enhancement of Catalyst Activity of Trialkylsilyl Sulfonates on the Mukaiyama Aldol Reaction: A New Approach Using Bulky Organoaluminum Cocatalysts
作者:Masataka Oishi、Seiji Aratake、Hisashi Yamamoto
DOI:10.1021/ja981464o
日期:1998.8.1
Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
申请人:Kim Dong-seok
公开号:US20070093640A1
公开(公告)日:2007-04-26
The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps. The first step is the manufacture of a transparent linear polyamic acid (A) from (a-1) one or more kinds of tetracarboxylic acid dianhydrides selected from alicyclic tetracarboxylic acid dianhydrides having 3 to 30 carbon atoms; and (a-2) one or more kinds of diamines selected from aliphatic, alicyclic, or non-conjugated aromatic diamines, having 3 to 30 carbon atoms, having one or more ethylenically unsaturated bonds at side chains as essential components; and the second step is the manufacture of reactive transparent polyimide precursors shown in the following Chemical Formula 1 according to the esterification reaction of the above polyamic acid (A) with ethylenically unsaturated compound (B) containing an epoxy group in the same molecule as the main component. The photosensitive transparent polyimide precursor resin compositions according to the present invention have a superior photosensitivity, and thus, may be used for transparent protection layers and insulation layers of liquid crystal display devices having superior heat resistance, chemical resistance, mechanical strength, and electricity insulation.
[EN] TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF<br/>[FR] PRECURSEUR DE POLYIMIDE EXTREMEMENT RESISTANT A LA CHALEUR, TRANSPARENT, ET COMPOSITION POLYIMIDE PHOTOSENSIBLE DE CE PRECURSEUR
申请人:LG CHEMICAL LTD
公开号:WO2004086146A1
公开(公告)日:2004-10-07
The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps. The first step is the manufacture of a transparent linear polyamic acid (A) from (a-1) one or more kinds of tetracarboxylic acid dianhydrides selected from alicyclic tetracarboxylic acid dianhydrides having 3 to 30 carbon atoms; and (a-2) one or more kinds of diamines selected from aliphatic, alicyclic, or non-conjugated aromatic diamines, having 3 to 30 carbon atoms, having one or more ethylenically unsaturated bonds at side chains as essential components; and the second step is the manufacture of reactive transparent polyimide precursors shown in the following Chemical Formula 1 according to the esterification reaction of the above polyamic acid (A) with ethylenically unsaturated compound (B) containing an epoxy group in the same molecule as the main component. The photosensitive transparent polyimide precursor resin compositions according to the present invention have a superior photosensitivity, and thus, may be used for transparent protection layers and insulation layers of liquid crystal display devices having superior heat resistance, chemical resistance, mechanical strength, and electricity insulation.
[EN] NOVEL OXIME ESTER COMPOUND AND PHOTORESIST COMPOSITION COMPRISING SAME<br/>[FR] NOUVEAU COMPOSÉ D'ESTER D'OXIME ET COMPOSITION DE RÉSINE PHOTOSENSIBLE LE COMPRENANT<br/>[KO] 신규한 옥심에스테르 화합물 및 이를 포함하는 포토레지스트 조성물
申请人:TREEEL CO LTD
公开号:WO2019216600A1
公开(公告)日:2019-11-14
본 발명은 옥심에스테르기가 치환된 방향족화합물, 이의 제조방법 및 이를 포함하는 포토레지스트 조성물에 관한 것으로서 UV를 효율적으로 흡수하여 고감도의 감광성 조성물을 제공하는데 유용하다.