FINE-PARTICLE STRUCTURE/SUBSTRATE COMPOSITE MEMBER AND PROCESS FOR PRODUCING SAME
申请人:Sony Corporation
公开号:EP2354086A1
公开(公告)日:2011-08-10
The present invention relates to a fine-particle structure/substrate composite member having a microstructure, such as a three-dimensional raised microstructure, which is formed by an assembly of fine particles, such as nanoparticles, on a substrate, and a method for producing the composite member without the need for a step of heating to a high temperature.
A substrate (1) having a smooth surface is prepared, a fine-particle layer (4) including fine particles (2) which are arranged along the surface is formed, and substituent molecules (4) are bonded to the fine particles (2) to change the fine-particle layer (4) to a fine-particle assembly layer (6) including the fine particles (2) to which the substituent molecules (4) are bonded, so that the center-to-center distance between the adjacent fine particles is increased to form a three-dimensional microstructure (7) in which a portion of the fine-particle assembly layer (6) is raised from the surface or the center-to-center distance between the adjacent fine particles is decreased to form a microstructure in which the fine-particle assembly layer (6) is absent in a portion of the surface, the substrate (1) being exposed in the absent portion (8).
本发明涉及一种具有微结构(如三维凸起微结构)的细颗粒结构/基底复合构件,该微结构是由细颗粒(如纳米颗粒)在基底上组装形成的,本发明还涉及一种无需加热至高温步骤即可生产该复合构件的方法。
制备具有光滑表面的基底 (1),形成包括沿表面排列的细颗粒 (2) 的细颗粒层 (4),并将取代基分子 (4) 粘合到细颗粒 (2) 上,从而将细颗粒层 (4) 转变为包括细颗粒 (2) 的细颗粒组装层 (6),取代基分子 (4) 被粘合到细颗粒组装层 (6) 上、使相邻细颗粒之间的中心到中心距离增大,以形成三维微结构 (7),其中细颗粒装配层 (6) 的一部分从表面凸起,或者使相邻细颗粒之间的中心到中心距离减小,以形成微结构,其中细颗粒装配层 (6) 在表面的一部分缺失,基底 (1) 在缺失部分 (8) 暴露。