In one preferred embodiment, polymers are provided that comprise a structure of the following Formula (I):
Photoresists that comprises such polymers also are provided.
New photoresists are provided that are useful in a variety of applications, including negative-tone development processes. Preferred resists comprise a first polymer comprising first units comprising a reactive nitrogen-containing moiety spaced from the polymer backbone, wherein the nitrogen-containing moiety produces a basic cleavage product during lithographic processing of the photoresist composition.
OVERCOAT COMPOSITIONS AND METHODS FOR PHOTOLITHOGRAPHY
申请人:Rohm and Haas Electronic Materials Korea Ltd.
公开号:US20170090287A1
公开(公告)日:2017-03-30
Topcoat compositions are provided that are suitably applied above a photoresist composition. Preferred topcoat compositions comprise a first polymer comprising first units comprising a reactive nitrogen-containing moiety spaced from the polymer backbone, wherein the nitrogen-containing moiety produces a basic cleavage product during lithographic processing of the photoresist composition.
STETTER H.; LANDSCHEIDT A., CHEM. BER., 1979, 112, NO 4, 1410-1419
作者:STETTER H.、 LANDSCHEIDT A.
DOI:——
日期:——
PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS
申请人:Rohm and Haas Electronic Materials LLC
公开号:US20160109800A1
公开(公告)日:2016-04-21
Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.