申请人:KABUSHIKI KAISHA TOSHIBA
公开号:EP0193643A2
公开(公告)日:1986-09-10
A curable resin composition comprising, (a) at least one of partially acrylated and methacrylated epoxy resins; (b) a sensitizer which can initiate at least one of acryloyl group or methacryloyl group by photoirradiation; and (c) a curing catalyst comprising an organic metal compound and an organic silicon compound. The curable resin composition of this invention can be cured by photoirradiation and heating, and the cured product obtained has excellent electrical characteristics, adhesiveness, humidity resistance and solder heat resistance, and therefore it can be expected to be useful for electrical insulating materials, paints, materials for solder resist, etc.
一种可固化树脂组合物,包括:(a) 部分丙烯酰化环氧树脂和甲基丙烯酰化环氧树脂中的至少一种;(b) 可通过光照射引发丙烯酰基或甲基丙烯酰基中的至少一种的敏化剂;(c) 由有机金属化合物和有机硅化合物组成的固化催化剂。 本发明的可固化树脂组合物可通过光照射和加热固化,所获得的固化产品具有优异的电气特性、粘合性、防潮性和耐焊热性,因此可用于电气绝缘材料、涂料、阻焊材料等。