摩熵化学
数据库官网
小程序
打开微信扫一扫
首页 分子通 化学资讯 化学百科 反应查询 关于我们
请输入关键词

1,2-bis-(2-ethoxy-ethylsulfanyl)-ethane | 14440-87-0

中文名称
——
中文别名
——
英文名称
1,2-bis-(2-ethoxy-ethylsulfanyl)-ethane
英文别名
Aethylen-bis-(β-aethoxy-aethylsulfid);1,2-Bis-(2-aethoxy-aethylmercapto)-aethan;3,12-Dioxa-6,9-dithiatetradecane;1-ethoxy-2-[2-(2-ethoxyethylsulfanyl)ethylsulfanyl]ethane
1,2-bis-(2-ethoxy-ethylsulfanyl)-ethane化学式
CAS
14440-87-0
化学式
C10H22O2S2
mdl
——
分子量
238.415
InChiKey
ACCZOZLPVQHRMY-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    175-190 °C(Press: 10 Torr)
  • 密度:
    1.0450 g/cm3(Temp: 4 °C)

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    14
  • 可旋转键数:
    11
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    69.1
  • 氢给体数:
    0
  • 氢受体数:
    4

反应信息

点击查看最新优质反应信息

文献信息

  • Technetium and rhenium complexes with thioether ligands—IV. Synthesis and structural characterization of binuclear oxorhenium(V) complexes with bidentate thioether coordination
    作者:Hans-Juergen Pietzsch、Hartmut Spies、Peter Leibnitz、Guenter Reck
    DOI:10.1016/0277-5387(94)00470-y
    日期:1995.7
    prepared by reduction of ReO4− with SnCl2 in strongly acidic solution and in the presence of aliphatic thioethers of the general formula RCH2CH2SCH2CH2SCH2CH2R′ (“S2”; R, R′ = H, Et; R = S—Bu, R′ = Et; R = O—Et, R′ = H; R, R′ = O—Et). Alternatively the compounds can be obtained by ligand exchange reactions starting from [ReOCl4]− in methanolic solution. A representative derived from 5,8-dithiadodecane
    摘要在强酸溶液中,在通式RCH2CH2S的脂肪族硫醚存在下,通过用SnCl2还原ReO4-制备了双核氧(V)络合物[ReO(“ S2”)Cl2] 2O。 CH2CH2SCH2CH2R'(“ S2”; R,R'= H,Et; R = S-Bu,R'= Et; R = O-Et,R'= H; R,R'= O —等等)。或者,可以通过在甲醇溶液中从[ReOCl4]-开始的配体交换反应获得化合物。已经通过X射线衍射研究了衍生自5,8-二二十二烷(R,R'= Et)的代表。该络合物由两个独立的[ReO(“ S2”)Cl2]单元桥接,该单元由氧原子桥接。每个rh原子都集中在一个扭曲的八面体中,赤道面由S2Cl2供体组形成。单元中的硫和氯原子相对于桥连氧处于反位置。
  • Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate
    申请人:FUJIFILM Corporation
    公开号:EP2145765A1
    公开(公告)日:2010-01-20
    A resin composition for laser engraving, including: a binder polymer; and a metal compound containing a metal selected from the group consisting of metals in Group 1 to Group 15 in the periodic table.
    一种用于激光雕刻的树脂组合物,包括:一种粘合剂聚合物;以及一种金属化合物,其中含有一种选自元素周期表中第 1 族至第 15 族金属的金属。
  • RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE
    申请人:KAWASHIMA Takashi
    公开号:US20090246469A1
    公开(公告)日:2009-10-01
    The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.
  • RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF PRODUCING RELIEF PRINTING PLATE
    申请人:KAWASHIMA Takashi
    公开号:US20100015416A1
    公开(公告)日:2010-01-21
    A resin composition for laser engraving, including: a binder polymer; and a metal compound containing a metal selected from the group consisting of metals in Group 1 to Group 15 in the periodic table.
  • US8278387B2
    申请人:——
    公开号:US8278387B2
    公开(公告)日:2012-10-02
查看更多