POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME
申请人:TORAY INDUSTRIES, INC.
公开号:US20150212412A1
公开(公告)日:2015-07-30
The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X
1
in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y
1
represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X
2
in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y
2
represents a diamine residue including at least two or more alkylene glycol units in the main chain.
本发明提供了一种正型光敏树脂组合物,能够获得低翘曲性的固化膜,并且在低于250℃的较低温度下烧结时具有高灵敏度和高分辨率。本发明揭示了一种正型光敏树脂组合物,包括(a)聚酰亚胺树脂,包括由一般式(1)表示的结构单元和由一般式(2)表示的结构单元,以及(b)喹喔啉二酮化合物。其中,聚酰亚胺树脂包括由一般式(1)表示的结构单元和由一般式(2)表示的结构单元,其酰亚胺化比例为85%或更高,并且一般式(1)表示的结构单元与一般式(2)表示的结构单元的比例在30:70至90:10的范围内,其中,一般式(1)中的X1表示包括1至4个芳香环的四羧酸残基,Y1表示包括1至4个芳香环的芳香二胺残基,一般式(2)中的X2表示包括1至4个芳香环的四羧酸残基,Y2表示主链中包含至少两个或更多的烷基二醇单元的二胺残基。