The invention provides a resin composition that is excellent in terms of coating workability and can supply reliability, including the soldering reflow resistance, to a semiconductor device when being used as a die attach material or an adhesive for a heat dissipation member. The resin composition of the invention contains a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and a (meth)acryl polymer or copolymer having a reactive functional group that can react with other reactive groups.
本发明提供了一种
树脂组合物,该
树脂组合物在用作芯片附着材料或散热部件的粘合剂时,涂层加工性优异,并能为半导体器件提供可靠性,包括耐焊接回流性。本发明的
树脂组合物含有至少具有一个官能团的共轭二烯化合物的聚合物或共聚物、热固性
树脂和具有可与其他反应性官能团反应的反应性官能团的(甲基)
丙烯酸聚合物或共聚物。