TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20180120702A1
公开(公告)日:2018-05-03
The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1),
wherein, X
1
represents a tetravalent organic group, and R
1
represents a group represented by the following general formula (2),
wherein, the dotted line represents a bonding, Y
1
represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, “k” represents 1, 2 or 3, and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.
本发明提供了一种四羧酸二酯化合物,其表示为以下通式(1):其中,X1表示四价有机基团,R1表示以下通式(2)所表示的基团:其中,虚线表示键合,Y1表示具有k+1价的有机基团,Rs表示含有至少一个硅原子的基团,“k”表示1、2或3,“n”表示0或1。可以提供一种四羧酸二酯化合物,该化合物能够引导聚合物的形成,该聚合物是由使用负光敏树脂组合物的基树脂制成的,该组合物能够形成细微图案并具有高分辨率,使用四羧酸二酯化合物制得的聚酰亚胺前体聚合物以及其制备方法。