PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET
申请人:Nishio Akinori
公开号:US20110067808A1
公开(公告)日:2011-03-24
To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend.
The pressure-sensitive adhesive sheet
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includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which:
the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×10
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to 4.0×10
5
N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×10
5
N/m or less;
the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less;
the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and
the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.
提供一种压敏粘合片,用于保护地面、薄、易碎的粘合物不会“弯曲”,并且在背面磨削完成后可以从易碎的粘合物上取下而不会损坏或污染易碎的粘合物。该压敏粘合片包括按照以下顺序排列的基层A、压敏粘合层A、基层B和压敏粘合层B:基层A在25℃下的杨氏模量和其厚度的乘积为1.0×105至4.0×105 N/m,在80℃下的杨氏模量和其厚度的乘积为2.8×105 N/m或更少;压敏粘合层A在80℃下的剪切模量为0.2 MPa或更少;基层B在25℃下的杨氏模量和其厚度的乘积小于基层A的杨氏模量和其厚度的乘积,并且在80℃加热时,MD和TD的收缩百分比各为20%或更多;压敏粘合层B在80℃下的杨氏模量为10 MPa或更高,对硅晶片的粘附强度(在拉伸速度为300 mm/min时的180度剥离)为0.2 N/10 mm或更少。