4,4'-双(环氧乙烷-2-基甲基)-1,1'-联苯 | 81591-83-5

• 分子结构分类: 有机化合物 - 木脂素、新木脂素和相关化合物
• 中文名称: 4,4'-双(环氧乙烷-2-基甲基)-1,1'-联苯
• 英文名称: 4,4'-Bis(oxiran-2-ylmethyl)-1,1'-biphenyl
• 英文别名: 2-[[4-[4-(oxiran-2-ylmethyl)phenyl]phenyl]methyl]oxirane
• CAS: 81591-83-5
• 化学式: C₁₈H₁₈O₂
• 分子量: 266.3
• InChiKey: ZSAICLUIVSNXGW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.5
• 重原子数：
  20
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  25.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• INSULATING SHEET AND LAMINATED STRUCTURE
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP2316897A1

  公开（公告）日：2011-05-04

  The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability. The insulating sheet used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer, comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy monomer (B1) having an aromatic skeleton and a weight average molecular weight of 600 or less and an oxetane monomer (B2) having an aromatic skeleton and a weight average molecular weight of 600 or less; (C) a curing agent; and (D) 20 to 60% by volume of a first inorganic filler; and (E) 1 to 40% by volume of at least one of an organic filler (E1), and a second inorganic filler (E2) that is different from the first inorganic filler (D) and has a new Mohs' hardness of 3 or less and, when the filler (E) contains the organic filler (E1), 3 to 40% by volume of the organic filler (E1).

  本发明提供了一种绝缘片材，它在未固化时具有极佳的可操作性，可防止在层压机中过度流动，并可提供具有极佳的介电击穿特性、导热性、耐热性和可加工性的固化产品。用于将导热系数为 10 W/m-K 或更高的热导体与导电层粘合的绝缘片材，包括(A) 具有 10,000 或以上重量平均分子量的聚合物；(B) 具有芳香族骨架且重量平均分子量为 600 或以下的环氧单体 (B1) 和具有芳香族骨架且重量平均分子量为 600 或以下的氧杂环丁烷单体 (B2) 中的至少一种；(C) 固化剂；(D) 20-60%（体积）的第一种无机填料；以及 (E) 1-40%（体积）的有机填料（E1）和第二种无机填料（E2）中的至少一种，第二种无机填料与第一种无机填料（D）不同，其新莫氏硬度为 3 或更低；当填料（E）包含有机填料（E1）时，有机填料（E1）的比例为 3-40%（体积）。
• 3D printable liquid crystalline elastomers with tunable shape memory behavior and bio-derived renditions
  申请人：UT-Battelle, LLC

  公开号：US10407535B2

  公开（公告）日：2019-09-10

  Described herein are liquid crystalline elastomer compositions comprising aromatic epoxy units crosslinked with alkylene diacid units having alkylene segments containing at least one methylene unit, and/or aromatic epoxy units crosslinked with polyphenolic units, wherein the aromatic epoxy units and alkylene diacid units and/or polyphenolic units are in a molar ratio that results in the liquid crystalline elastomer composition exhibiting a glass transition temperature (Tg) and a thermal stability of the liquid crystalline phase (Tlc) that make them particularly suitable as shape memory materials and for use in methods of additive manufacturing. Methods for producing these compositions and their use in additive manufacturing processes are also described.

  本文描述的液态结晶弹性体组合物由芳香族环氧单元与具有至少含有一个亚甲基单元的亚烷基段的亚烷基二酸单元交联和/或芳香族环氧单元与多酚单元交联组成、其中芳香族环氧单元与亚烷基二酸单元和/或多酚单元的摩尔比使液晶弹性体组合物显示出玻璃化转变温度（Tg）和液晶相的热稳定性（Tlc），使其特别适合用作形状记忆材料和添加制造方法。此外，还介绍了生产这些组合物的方法及其在快速成型制造工艺中的应用。
• Resin material and laminate
  申请人：SEKISUI CHEMICAL CO., LTD.

  公开号：US11168216B2

  公开（公告）日：2021-11-09

  Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.

  本发明提供了一种能够有效改善绝缘性能和热导率并有效控制介电击穿强度变化的树脂材料。根据本发明，一种树脂材料包括第一氮化硼骨料颗粒、第二氮化硼骨料颗粒和粘结剂树脂，第二氮化硼骨料颗粒的 10% K 值小于第二氮化硼骨料颗粒的 30% K 值，第二氮化硼骨料颗粒的 30% K 值小于第一氮化硼骨料颗粒的 10% K 值。
• Epoxy resin composition and semiconductor device
  申请人：Kotani Takahiro

  公开号：US20060157872A1

  公开（公告）日：2006-07-20

  An epoxy resin composition for encapsulating a semiconductor chip containing (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

  一种用于封装半导体芯片的环氧树脂组合物，含有(A)结晶环氧树脂，(B)通式(1)代表的苯酚树脂： 其中 R1 和 R2 独立地为氢或具有 1 至 4 个碳原子的烷基，且两个或两个以上的 R1 或两个或两个以上的 R2 相同或不同；a 为 0 至 4 的整数；b 为 0 至 4 的整数；c 为 0 至 3 的整数；n 为 0 至 10 的平均数；(C)含有丁二烯衍生结构单元或其衍生物的（共）聚合物；以及(D)无机填料，其在环氧树脂组合物总量中的含量为 80 重量％至 95 重量％（含）。
• THERMOSETTING MATERIAL AND CURED PRODUCT
  申请人：Sekisui Chemical Co., Ltd.

  公开号：EP3378899B1

  公开（公告）日：2021-09-29