申请人:Daicel Corporation
公开号:EP3006481A1
公开(公告)日:2016-04-13
A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.
根据本发明用于密封光学半导体的可固化组合物包括组分(A)、(B)和(C)。根据本发明的另一种用于密封光学半导体的可固化组合物,除组分(A)、(B)和(C)外,还包括组分(D)。组分(A)是含有至少一个官能团的化合物,该官能团选自由环氧基、氧杂环丁基、乙烯基醚基和(甲基)丙烯酰基组成的组。组分 (B) 是环脂族环氧化合物。组份(C)是一种固化催化剂,包括阳离子组份和阴离子组份,并在光或热作用下产生酸,其中阳离子组份含有芳香环,阴离子组份含有选自硼和磷的中心元素。成分(D)为导电纤维颗粒,每个颗粒包括微粒物质和位于微粒物质上或微粒物质上的纤维状导电物质。