1,4-bis-(3-amino-propoxy)-cyclohexane | 13818-22-9

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 1,4-bis-(3-amino-propoxy)-cyclohexane
• 英文别名: 1,4-Bis-(3-amino-propoxy)-cyclohexan；3-[4-(3-Aminopropoxy)cyclohexyl]oxypropan-1-amine
• CAS: 13818-22-9
• 化学式: C₁₂H₂₆N₂O₂
• 分子量: 230.351
• InChiKey: KCXHXCFUNOEJFM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.1
• 重原子数：
  16
• 可旋转键数：
  8
• 环数：
  1.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  1,4-环己二醇 在 甲醇 、 kieselguhr 、 乙醇 、 氨 、 sodium ethanolate 、 镍 作用下， 140.0 ℃ 、23.53 MPa 条件下， 生成 1,4-bis-(3-amino-propoxy)-cyclohexane
  参考文献：
  名称：

  Production of polyamides of high molecular weight utilizing 1:4-bis-(3-aminopropoxy)-cyclohexane

  摘要：

  公开号：

  US02577621A1

文献信息

• ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME
  申请人：Kaimori Shingo

  公开号：US20110303439A1

  公开（公告）日：2011-12-15

  Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.
• ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME
  申请人：Kaimori Shingo

  公开号：US20120043118A1

  公开（公告）日：2012-02-23

  Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
• US4528304A
  申请人：——

  公开号：US4528304A

  公开（公告）日：1985-07-09
• US6951665B2
  申请人：——

  公开号：US6951665B2

  公开（公告）日：2005-10-04
• US9181464B2
  申请人：——

  公开号：US9181464B2

  公开（公告）日：2015-11-10