To provide a resin composition having excellent thermal conductivity. Especially, to provide: a liquid crystal polymer composition which is suitable for the formation of a semi-cured thermally conductive film that has excellent thermal conductivity, bondability and low-temperature processability; and a circuit board which uses this liquid crystal polymer composition. Additionally, to provide a curable resin composition which has bonding strength in addition to high thermal conductivity. A resin composition which contains (á) a curable compound, (â) a curing agent, (ã) a liquid crystal polymer that forms a liquid crystal phase at 190°C or less, and (ä) a filler. Specifically, the above-described resin composition which is a liquid crystal polymer composition containing (I) a compound having two or more epoxy groups in each molecule, (II) a curing agent, (III) a fine powder of a liquid crystal polymer that forms an anisotropic melt form at 190°C or less, (IV) a heat transfer filler and (V) a solvent. In addition, the above-described resin composition which is a curable resin composition composed of the following components (A), (B), (C), (D) and (E): (A) a thermoplastic resin having a specific structure; (B) a curable resin; (C) a curing agent; (D) an elastomer; and (E) an inorganic filler.
提供一种具有优异导热性能的
树脂组合物。特别是提供:一种液晶聚合物组合物,它适用于形成半固化导热膜,具有优异的导热性、粘合性和低温加工性;以及一种使用这种液晶聚合物组合物的电路板。此外,提供一种除具有高导热性外,还具有粘合强度的可固化
树脂组合物。一种
树脂组合物,它包含(á)一种可固化化合物、(§)一种固化剂、(ã)一种在 190°C 或更低温度下形成液晶相的液晶聚合物以及(ä)一种填料。具体地说,上述
树脂组合物是一种液晶聚合物组合物,其中含有(I)每个分子中含有两个或两个以上环氧基团的化合物;(II)固化剂;(III)在 190℃或更低温度下形成各向异性熔体的液晶聚合物的细粉;(IV)传热填料;(V)溶剂。此外,上述
树脂组合物是一种可固化
树脂组合物,由以下组分(A)、(B)、(C)、 (D)和(E)组成:(A)具有特定结构的热塑性
树脂;(B)可固化
树脂;(C)固化剂; (D)弹性体;以及(E)无机填料。