1-乙基-2-甲基环丙醇 | 406936-16-1

• 分子结构分类: 有机化合物 - 有机氧化合物
• 中文名称: 1-乙基-2-甲基环丙醇
• 英文名称: 1-ethyl-2-methylcyclopropanol
• 英文别名: 2-Methyl-1-ethyl-cyclopropanol；1-Ethyl-2-methylcyclo-propanol；1-ethyl-2-methylcyclopropan-1-ol
• CAS: 406936-16-1
• 化学式: C₆H₁₂O
• 分子量: 100.161
• InChiKey: QNGGJLIQIQLMQV-UHFFFAOYSA-N

物化性质

• 沸点：
  117.5±8.0 °C(Predicted)
• 密度：
  0.942±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  7
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  1-乙基-2-甲基环丙醇 在 氢氧化钾 作用下， 以 水 、 正戊烷 为溶剂， 以5%的产率得到2-甲基-3-戊酮
  参考文献：
  名称：

  摘要：

  DOI：

  10.1023/a:1013108918406
• 作为产物：
  描述：

  1-((trimethylsilyl)oxy)-1-ethyl-2-methylcyclopropane 在 对甲苯磺酸 作用下， 生成 1-乙基-2-甲基环丙醇
  参考文献：
  名称：

  Le Goaller,R.; Pierre,J.-L., Bulletin de la Societe Chimique de France, 1973, p. 1531 - 1532

  摘要：

  DOI：

文献信息

• METHOD OF FORMING SEMICRYSTALLINE POLYETHERIMIDE, AND POLYETHERIMIDE-CONTAINING COMPOSITION
  申请人：SABIC Global Technologies B.V.

  公开号：EP3741792A1

  公开（公告）日：2020-11-25

  In a method of forming a semicrystalline polyetherimide, a solvent mixture is combined with an amorphous polyetherimide in a weight ratio of 1:1 to 50:1, respectively, to form a first dispersion. The solvent mixture includes dichloromethane and a C1-C6 alkanol in a weight ratio of 0.5:1 to 15:1, respectively. The first dispersion is agitated to form a second dispersion containing a semicrystalline polyetherimide, and the semicrystalline polyetherimide is isolated from the second dispersion. The isolated semicrystalline polyetherimide exhibits a melting point in a range of 230 to 300 °C. Also described is a composition that includes a polyetherimide, dichloromethane, and a C1-C6 alkanol in specific ratios.

  在一种形成半结晶聚醚酰亚胺的方法中，将溶剂混合物与无定形聚醚酰亚胺分别以 1:1 至 50:1 的重量比混合，形成第一分散液。溶剂混合物包括重量比分别为 0.5:1 至 15:1 的二氯甲烷和 C1-C6 烷醇。搅拌第一分散液以形成含有半结晶聚醚酰亚胺的第二分散液，并从第二分散液中分离出半结晶聚醚酰亚胺。分离出的半结晶聚醚酰亚胺的熔点范围为 230 ℃ 至 300 ℃。还描述了一种组合物，该组合物包括特定比例的聚醚酰亚胺、二氯甲烷和 C1-C6 烷醇。
• Method for electroplating bath chemistry control
  申请人：——

  公开号：US20040217005A1

  公开（公告）日：2004-11-04

  A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive breakdown, and discarding the electroplating bath after a predetermined bath lifetime. The method includes predetermining a lifetime of an electroplating bath solution having a desired chemical composition, combining a plurality of electroplating bath solution components thereby forming the electroplating bath solution having the desired chemical composition, filling a small-volume plating cell with the electroplating bath solution, plating a plurality of substrates in the electroplating bath solution until the bath lifetime is reached; and discarding the electroplating bath solution after the bath lifetime is reached.

  一种控制电镀槽溶液化学成分的方法，用于对多个基底进行电镀，方法是将电镀槽溶液提供给一个小容量电镀池，该电镀池的配置可最大限度地减少添加剂的分解，并在预定的电镀槽寿命之后丢弃电镀槽。该方法包括预先确定具有所需化学成分的电镀槽溶液的寿命，组合多种电镀槽溶液成分从而形成具有所需化学成分的电镀槽溶液，用电镀槽溶液填充小容量电镀池，在电镀槽溶液中电镀多种基底，直到达到电镀槽寿命；以及在达到电镀槽寿命后丢弃电镀槽溶液。
• METHOD FOR ELECTROPLATING BATH CHEMISTRY CONTROL
  申请人：APPLIED MATERIALS, INC.

  公开号：EP1753897A1

  公开（公告）日：2007-02-21
• Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith
  申请人：Ishizuka Hiroshi

  公开号：US20080087549A1

  公开（公告）日：2008-04-17

  An additive for copper plating comprising, as an effective ingredient, a nitrogen-containing biphenyl derivative represented by the following formula (I): [wherein X represents a group selected from the following groups (II)-(VII): and Y represents a lower alkyl group, lower alkoxy group, nitro group, amino group, sulfonyl group, cyano group, carbonyl group, 1 -pyridyl group, or the formula (VIII): (wherein R′ represents a lower alkyl group)], a copper plating solution formed by adding the additive for copper plating to a copper plating solution containing a copper ion ingredient and an anion ingredient, and a method of manufacturing on an electronic circuit substrate having a fine copper wiring circuit, which comprises electroplating in the copper plating solution using as the cathode an electronic circuit substrate in which fine microholes or microgrooves in the shape of an electronic circuit are formed on the surface. The additive for copper plating can fill through holes or via holes at a micron or sub-micron level even in a case where it consists of one component, and the copper plating solution using the additive for copper plating can be prepared and handled extremely easily and can stably fill the through holes or via holes for a long time.
• METHOD OF FORMING SEMICRYSTALLINE POLYETHERIMIDE, AND POLYETHERIMIDECONTAINING COMPOSITION
  申请人：SHPP GLOBAL TECHNOLOGIES B.V.

  公开号：US20220162387A1

  公开（公告）日：2022-05-26

  In a method of forming a semicrystalline polyetherimide, a solvent mixture is combined with an amorphous polyetherimide in a weight ratio of 1:1 to 50:1, respectively, to form a first dispersion. The solvent mixture includes dichloromethane and a C 1 -C 6 alkanol in a weight ratio of 0.5:1 to 15:1, respectively. The first dispersion is agitated to form a second dispersion containing a semicrystalline polyetherimide, and the semicrystalline polyetherimide is isolated from the second dispersion. The isolated semicrystalline polyetherimide exhibits a melting point in a range of 230 to 300° C. Also described is a composition that includes a polyetherimide, dichloromethane, and a C 1 -C 6 alkanol in specific ratios.