A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.
Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US11054744B2
公开(公告)日:2021-07-06
Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.
A liquid discharge head having a substrate provided with energy generating elements for generating energy to discharge a liquid, discharge portions including discharge ports for discharging the liquid, and flow paths supplying the liquid to the discharge portions and a method for its manufacture are provided. The method includes the steps of forming a layer of a negative type photosensitive resin on the substrate, and exposing the layer to light having a wavelength of 365 nm to form the discharge portions.