The first chamber cleaning gas and the first silicon-containing film-etching gas of the present invention comprise at least one compound selected from the group consisting of FCOF, CF
3
OCOF and CF
3
OCF
2
OCOF, and O
2
in the specific amount, and optionally other gases. The second chamber cleaning gas and the second silicon-containing film-etching gas comprise CF
3
COF, C
3
F
7
COF or CF
2
(COF)
2
and O
2
in specific amounts, and optionally may comprise other gases.
The chamber cleaning gases and silicon-containing film etching gases of the present invention have a low global warming potential and hardly generate substances in the exhaust gases such as CF
4
, etc, which are harmful to the environment and have been perceived as contributing to global warming. Therefore, the gases are friendly to the global environment, and have easy handling and excellent exhaust gas treating properties. Further, the chamber cleaning gases of the invention have excellent cleaning rate.
本发明的第一室清洗气体和第一
硅含膜刻蚀气体包括至少选自FCOF、 COF和
CF3OCF2OCOF组合的一种化合物,以及特定量的O2,并可选其他气体。第二室清洗气体和第二
硅含膜刻蚀气体包括CF3COF、C3F7COF或
CF2(COF)2以及特定量的O2,并且可选其他气体。本发明的清洗气体和
硅含膜刻蚀气体具有较低的全球变暖潜力,几乎不会产生对环境有害且被认为是导致全球变暖的气体,如
CF4等排放物质。因此,这些气体对全球环境友好,易于处理,具有出色的排放气体处理性能。此外,本发明的清洗气体具有出色的清洗速率。