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3-hydroxy-3,4-dimethyl-1-phenylpentan-1-one | 42107-79-9

中文名称
——
中文别名
——
英文名称
3-hydroxy-3,4-dimethyl-1-phenylpentan-1-one
英文别名
3-Hydroxy-3,4-dimethyl-1-phenylpentan-1-on
3-hydroxy-3,4-dimethyl-1-phenylpentan-1-one化学式
CAS
42107-79-9
化学式
C13H18O2
mdl
——
分子量
206.285
InChiKey
OPJFJKUOVOKPDG-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    325.4±25.0 °C(Predicted)
  • 密度:
    1.024±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    2.4
  • 重原子数:
    15
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.46
  • 拓扑面积:
    37.3
  • 氢给体数:
    1
  • 氢受体数:
    2

上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

  • 作为反应物:
    描述:
    甲基碘化镁3-hydroxy-3,4-dimethyl-1-phenylpentan-1-one 生成 4,5-Dimethyl-2-phenylhexan-2,4-diol
    参考文献:
    名称:
    Esafov,V.I. et al., Russian Journal of Organic Chemistry, 1973, vol. 9, p. 233 - 235
    摘要:
    DOI:
  • 作为产物:
    描述:
    参考文献:
    名称:
    均相催化。过渡金属基路易斯酸催化剂。
    摘要:
    基于过渡金属的路易斯酸为Diels-Alder和Mukaiyama反应提供了催化剂。这些催化剂必须具有缺电子的亲金属中心和不稳定的配位位置。与传统的路易斯酸不同,衍生自过渡金属的那些可以在水的存在下起作用,并具有明确的结构。显示了如何通过引入吸电子配体和具有硬供体原子的配体将通常富电子的钌原子转化为路易斯酸。该钌络合物[Ru(salen)(NO)(H 2 O)] +是狄尔斯-阿尔德反应的有效催化剂,但在Mukaiyama反应中,它倾向于被还原并因此被甲硅烷基烯醇醚失活。结果表明,复数[TiCp * 2即使存在水,(H 2 O)2 ] 2+(Cp *是五甲基环戊二烯基)也是用于狄尔斯-阿尔德反应的有效催化剂。类似地,三氟配合物[TiCp 2(CF 3 SO 3)2 ]和[ZrCp 2(CF 3 SO 3)2 ](Cp为环戊二烯基)是狄尔斯-阿尔德反应和Mukaiyamayama反应的有效催化剂。所有这些催化剂在≈1
    DOI:
    10.1016/s0040-4020(01)87259-8
点击查看最新优质反应信息

文献信息

  • Isopropylmagnesium chloride-promoted unilateral addition of Grignard reagents to β-diketones: one-pot syntheses of β-tertiary hydroxyl ketones or 3-substituted cyclic-2-enones
    作者:Rui Yuan、Dan Zhao、Li-Yuan Zhang、Xiang Pan、Yan Yang、Pei Wang、Hong-Feng Li、Chao-Shan Da
    DOI:10.1039/c5ob02072g
    日期:——
    unilateral additions of Grignard reagents to acyclic or cyclic β-diketones were effectively promoted by sub-stoichiometric amounts of i-PrMgCl to afford β-tertiary hydroxyl ketones or 3-substituted cyclic-2-enones, respectively. Also, the addition of Grignard reagents to acyclic β-diketones followed by a reaction with cyclic β-diketones in a one-pot process was put forward. The reaction mechanism was discussed
    亚化学计量的i-PrMgCl有效促进了格氏试剂向无环或环状β-二酮的区域选择性单侧添加,从而分别提供了β-叔羟基酮或3-取代的环-2-烯酮。此外,提出了在单锅法中将格氏试剂添加到无环β-二酮中,然后与环状β-二酮反应。通过化学实验,氢-氘交换和质谱对反应机理进行了详细讨论,以解释其高区域选择性。
  • Remarkable Enhancement of Catalyst Activity of Trialkylsilyl Sulfonates on the Mukaiyama Aldol Reaction:  A New Approach Using Bulky Organoaluminum Cocatalysts
    作者:Masataka Oishi、Seiji Aratake、Hisashi Yamamoto
    DOI:10.1021/ja981464o
    日期:1998.8.1
  • Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
    申请人:Kim Dong-seok
    公开号:US20070093640A1
    公开(公告)日:2007-04-26
    The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps. The first step is the manufacture of a transparent linear polyamic acid (A) from (a-1) one or more kinds of tetracarboxylic acid dianhydrides selected from alicyclic tetracarboxylic acid dianhydrides having 3 to 30 carbon atoms; and (a-2) one or more kinds of diamines selected from aliphatic, alicyclic, or non-conjugated aromatic diamines, having 3 to 30 carbon atoms, having one or more ethylenically unsaturated bonds at side chains as essential components; and the second step is the manufacture of reactive transparent polyimide precursors shown in the following Chemical Formula 1 according to the esterification reaction of the above polyamic acid (A) with ethylenically unsaturated compound (B) containing an epoxy group in the same molecule as the main component. The photosensitive transparent polyimide precursor resin compositions according to the present invention have a superior photosensitivity, and thus, may be used for transparent protection layers and insulation layers of liquid crystal display devices having superior heat resistance, chemical resistance, mechanical strength, and electricity insulation.
  • [EN] TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF<br/>[FR] PRECURSEUR DE POLYIMIDE EXTREMEMENT RESISTANT A LA CHALEUR, TRANSPARENT, ET COMPOSITION POLYIMIDE PHOTOSENSIBLE DE CE PRECURSEUR
    申请人:LG CHEMICAL LTD
    公开号:WO2004086146A1
    公开(公告)日:2004-10-07
    The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps. The first step is the manufacture of a transparent linear polyamic acid (A) from (a-1) one or more kinds of tetracarboxylic acid dianhydrides selected from alicyclic tetracarboxylic acid dianhydrides having 3 to 30 carbon atoms; and (a-2) one or more kinds of diamines selected from aliphatic, alicyclic, or non-conjugated aromatic diamines, having 3 to 30 carbon atoms, having one or more ethylenically unsaturated bonds at side chains as essential components; and the second step is the manufacture of reactive transparent polyimide precursors shown in the following Chemical Formula 1 according to the esterification reaction of the above polyamic acid (A) with ethylenically unsaturated compound (B) containing an epoxy group in the same molecule as the main component. The photosensitive transparent polyimide precursor resin compositions according to the present invention have a superior photosensitivity, and thus, may be used for transparent protection layers and insulation layers of liquid crystal display devices having superior heat resistance, chemical resistance, mechanical strength, and electricity insulation.
  • [EN] NOVEL OXIME ESTER COMPOUND AND PHOTORESIST COMPOSITION COMPRISING SAME<br/>[FR] NOUVEAU COMPOSÉ D'ESTER D'OXIME ET COMPOSITION DE RÉSINE PHOTOSENSIBLE LE COMPRENANT<br/>[KO] 신규한 옥심에스테르 화합물 및 이를 포함하는 포토레지스트 조성물
    申请人:TREEEL CO LTD
    公开号:WO2019216600A1
    公开(公告)日:2019-11-14
    본 발명은 옥심에스테르기가 치환된 방향족화합물, 이의 제조방법 및 이를 포함하는 포토레지스트 조성물에 관한 것으로서 UV를 효율적으로 흡수하여 고감도의 감광성 조성물을 제공하는데 유용하다.
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