ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE
申请人:Sumitomo Electric Industries, Ltd.
公开号:EP2445323A1
公开(公告)日:2012-04-25
By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.
ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE
申请人:Yamamoto Masamichi
公开号:US20110250395A1
公开(公告)日:2011-10-13
There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode
2
and a second connection electrode
10
are connected to each other with a conductive adhesive layer
9
therebetween includes organic films
6
and
11
formed on at least the first connection electrode and conductive particles
8
contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.