1-(3-methylphenyl)-1H-benzo[d][1,2,3]triazole | 301169-20-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 1-(3-methylphenyl)-1H-benzo[d][1,2,3]triazole
• 英文别名: 1-(m-tolyl)-1H-benzo[d][1,2,3]triazole；1-(3-methylphenyl)-1H-benzotriazole；1-(3-methylphenyl)-1H-1,2,3-benzotriazole；1-(3-methylphenyl)benzotriazole
• CAS: 301169-20-0
• 化学式: C₁₃H₁₁N₃
• 分子量: 209.25
• InChiKey: XVVVTMDTVHLXHH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.1
• 重原子数：
  16
• 可旋转键数：
  1
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  30.7
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  1-(3-methylphenyl)-1H-benzo[d][1,2,3]triazole 、 二苯基乙炔 在 tris(triphenylphosphine)rhodium(l) chloride 、 silver trifluoromethanesulfonate 作用下， 以 均三甲苯 为溶剂， 反应 12.0h， 以65%的产率得到1-(5-methyl-2-((E)-1,2-diphenylvinyl)phenyl)-1H-benzo[d][1,2,3]triazole
  参考文献：
  名称：

  Rhodium-catalyzed intermolecular hydroarylation of internal alkynes with N-1-phenylbenzotriazoles

  摘要：

  描述了一种铑催化的内炔与N-1-苯基苯并三嗪的分子间氢芳基化反应，采用C-H键活化。这一转化提供了一种高立体选择性的内炔氢芳基化的替代方法。根据氘标记实验讨论了反应机制。

  DOI：

  10.1039/c3ob42007h
• 作为产物：
  描述：

  在 copper(l) iodide 、 1,10-菲罗啉 、 sodium t-butanolate 作用下， 以 二甲基亚砜 为溶剂， 反应 10.0h， 以73.5%的产率得到1-(3-methylphenyl)-1H-benzo[d][1,2,3]triazole
  参考文献：
  名称：

  通过铜（I）催化的分子内环化反应新颖和区域特异性合成1-芳基-1H-苯并三唑

  摘要：

  1-Aryl-1 H-苯并三唑衍生物是通过容易获得的三氮烯的分子内环化反应合成的，使用CuI作为催化剂，DMSO作为溶剂，t -BuONa作为碱，1,10-菲咯啉作为配体，直至产率97％。合成具有区域特异性和功能基团耐受性。

  DOI：

  10.1002/hlca.200900384

文献信息

• [3 + 2] Cycloaddition of azides with arynes formed<i>via</i>C–H deprotonation of aryl sulfonium salts
  作者：Xing-Wei Gu、Yan-Hua Zhao、Xiao-Feng Wu

  DOI：10.1039/d3gc02052e

  日期：——

  Herein, we developed a new methodology of using aryl sulfonium salts as the aryne precursor for [3 + 2] cycloaddition reactions with azides. The reaction using readily available arenes as the feedstock features excellent atom economy, environmental friendliness and high functional group tolerance. Moreover, due to the excellent performance of the gram-scale reaction, deuterium labeling result and derivatization

  在此，我们开发了一种使用芳基锍盐作为芳基前体与叠氮化物进行[3 + 2]环加成反应的新方法。该反应以易得的芳烃为原料，具有优异的原子经济性、环境友好性和高官能团耐受性。此外，由于克级反应、氘标记结果和衍生化反应的优异性能，具有大规模生产和其他应用的潜在机会。
• CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD
  申请人：Wako Pure Chemical Industries, Ltd.

  公开号：EP1679361A1

  公开（公告）日：2006-07-12

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor - Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.

  本发明提供了一种用于基板的清洗剂及其清洗方法，该清洗剂可有效去除存在于基板表面的细小颗粒（微粒）或来自各种金属的杂质（金属杂质），而不会导致基板（尤其是半导体基板）表面粗糙，也不会导致设置在基板表面的金属线（尤其是铜线）腐蚀或氧化，并可进一步同时去除存在于基板表面的碳缺陷，而不会去除金属缓蚀剂-Cu膜（尤其是Cu-BTA膜）。 本发明提供了一种用于基材的清洗剂，包括[I]具有至少一个羧基的有机酸和/或[II]络合剂，以及[III]选自以下组别的有机溶剂：(1)一元醇、(2)烷氧基乙醇、(3)乙二醇、(4)乙二醇醚、(5)酮和(6)腈。
• IMINOTHIADIAZINE DIOXIDE COMPOUNDS AS BACE INHIBITORS, COMPOSITIONS, AND THEIR USE
  申请人：Merck Sharp & Dohme Corp.

  公开号：EP2485591B1

  公开（公告）日：2016-03-23
• BENZIMIDAZOLE AND IMADAZOPYRIDINE CARBOXIMIDAMIDE COMPOUNDS HAVING ACTIVITY AS INHIBITORS OF INDOLEAMINE 2,3-DIOXYGENASE
  申请人：Gilead Sciences, Inc.

  公开号：EP3294732B1

  公开（公告）日：2019-09-25
• Cleaning Agent for Substrate and Cleaning Method
  申请人：Mizuta Hironori

  公开号：US20070235061A1

  公开（公告）日：2007-10-11

  The present invention provides a cleaning agent for a substrate and a cleaning method thereof, which can effectively remove fine particles (particles) present on a surface of substrate or impurities derived from various kinds of metals (metallic impurities), without causing roughness surface of a substrate, in particular, a semiconductor substrate, and without causing corrosion or oxidation of metal wirings, in particular, copper wirings, provided on a surface of substrate, and can further remove at the same time a carbon defect present on a surface of substrate, without removing a metal corrosion inhibitor—Cu film, in particular, a Cu-BTA film. The present invention provides a cleaning agent for a substrate comprising [I] an organic acid having at least one carboxyl group and/or [II] a complexing agent, and [III] an organic solvent selected from the group consisting of (1) monohydric alcohols, (2) alkoxyalcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles, and a cleaning method for a surface of substrate, which comprises the surface of substrate is treated with said cleaning agent.