[EN] ORGANOMETALLIC COMPOUNDS AND DEVICES MADE WITH SUCH COMPOUNDS<br/>[FR] COMPOSÉS ORGANOMÉTALLIQUES ET DISPOSITIFS FAITS DE CES COMPOSÉS
申请人:DU PONT
公开号:WO2005124889A1
公开(公告)日:2005-12-29
The present invention is generally directed to organometallic compounds having Formula (I), Formula (II), or Formula (III) and devices having a layer including at least one of these compounds: (I), (II), (III) wherein: L1 is selected from an aryl-N-heterocycle ligand and a heteroaryl-N-heterocycle ligand , L2 is an anionic ligand , L3 is a nonionic ligand , L4 is selected from L1 and L2 M is a metal selected from Re, Ru, Os, Rh, Ir, Pd, Pt, and Au Fw is a moiety capable of bearing at least two (L4 -Ye) groups Y is a group selected from alkylene, heteroalkylene, alkenylene, heteroalkenylene, and alkynylene a is selected from 1and 2 b is selected from 0 and 1 c is selected from 0, 1, and 2 d is selected from 0 and an integer from 1 through 8 e is selected from 0 and 1 f is selected from 0 and 1 g is an integer from 1 through 4, and h is selected from 1and 2, with the proviso that a, b, and c are selected such that the metal is tetracoordinate when M is Au, Pd, or Pt, and the metal is hexacoordinate when M is Re, Ru, Os, Rh, or Ir, and with the proviso that when f = 0, then e = 0 and there is at least one substituent R1 on at least one ligand, wherein R1 is solvent-solubilizing. .