α-Benzyl-benzoin-methylether | 27962-37-4

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 直链 1,3-二芳基丙烷
• 英文名称: α-Benzyl-benzoin-methylether
• 英文别名: 2-Methoxy-1,2,3-triphenylpropan-1-one；2-methoxy-1,2,3-triphenylpropan-1-one
• CAS: 27962-37-4
• 化学式: C₂₂H₂₀O₂
• 分子量: 316.4
• InChiKey: YLIHAHJCTDPHCC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5
• 重原子数：
  24
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.14
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  氯化苄 、 alkaline earth salt of/the/ methylsulfuric acid 在 sodium hydroxide 作用下， 以 二甲基亚砜 为溶剂， 生成 α-Benzyl-benzoin-methylether
  参考文献：
  名称：

  Heine,H.-G., Justus Liebigs Annalen der Chemie, 1970, vol. 735, p. 56 - 64

  摘要：

  DOI：

文献信息

• Improved hot melt compositions
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：EP2182786A1

  公开（公告）日：2010-05-05

  Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.

  热熔胶组合物包括酸性蜡和不含酸基的丙烯酸酯功能单体。在使用光辐射时，热熔胶组合物会固化形成蚀刻抗蚀剂。热熔胶组合物可用于制造印刷电路板、光电和光伏设备。
• ACRYLIC FILM FOR PUNCHING, SURFACE LIGHT SOURCE DEVICE, AND PROCESS FOR PRODUCTION OF OPTICAL MEMBER
  申请人：Mitsubishi Rayon Co., Ltd.

  公开号：EP2455417A1

  公开（公告）日：2012-05-23

  Provided is an acrylic film for punching excellent in transparency and free from breakage or whitening even if it is punched. The present invention is an acrylic film for punching containing a polymer (C) containing a di(meth)acrylate (A) unit represented by general formula (1) below and a mono(meth)acrylate (B) unit:         -CH2-CR1-COO-(X)n-COCR1-CH2-     (1) wherein (X) represents at least one repeat unit selected from C2H4O, C3H6O and C4H8O, the molecular weight of (X)n is 500 or more; and R1 represents H or CH3.

  本发明提供了一种透明性极佳、即使冲孔也不会破损或发白的冲孔用丙烯酸薄膜。本发明是一种冲孔用丙烯酸薄膜，它含有一种聚合物（C），该聚合物含有如下通式（1）表示的二（甲基）丙烯酸酯（A）单元和单（甲基）丙烯酸酯（B）单元： -CH2-CR1-COO-(X)n-COCR1-CH2- (1) 其中 (X) 代表至少一个选自 C2H4O、C3H6O 和 C4H8O 的重复单元，(X)n 的分子量为 500 或更多；R1 代表 H 或 CH3。
• HIGH REFRACTIVE INDEX MATERIALS
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：EP3981806A1

  公开（公告）日：2022-04-13

  Disclosed is a formulation comprising a copolymer comprising one or more high refractive index first monomers and one or more second monomers comprising a reactive side chain and one or more solvents. The formulation may optionally contain additional components. Further disclosed are methods for forming optical thin films from the formulation and optical devices containing the optical thin films.

  本发明公开了一种配方，它包含一种共聚物，该共聚物由一种或多种高折射率第一单体和一种或多种包含反应性侧链的第二单体以及一种或多种溶剂组成。该配方还可选择包含其他成分。此外，还公开了用该配方形成光学薄膜的方法以及含有该光学薄膜的光学设备。
• Process
  申请人：Hopper John Alan

  公开号：US20060019077A1

  公开（公告）日：2006-01-26

  A process for making a printed circuit board having a solder mask and area(s) of exposed metal circuitry which comprises the steps: a) applying a non-aqueous ink which is substantially free from organic solvent to a printed circuit board; b) curing the ink by exposure to actinic radiation; and c) optionally heating the ink; whereby the ink is applied to selected areas of the printed circuit board by means of an ink jet printer and wherein the ink comprises: i) a cationically curable compound; and ii) a cationic initiator.

  一种用于制造具有阻焊层和外露金属电路区域的印刷电路板的工艺，包括以下步骤：a) 将基本上不含有机溶剂的非水性墨水涂在印刷电路板上；b) 将墨水暴露在光辐射下使其固化；以及 c) 可选地加热墨水；通过喷墨打印机将墨水涂在印刷电路板的选定区域，其中墨水包括：i) 阳离子可固化化合物；以及 ii) 阳离子引发剂。
• Process and ink for making electronic devices
  申请人：Hopper John Alan

  公开号：US20060154033A1

  公开（公告）日：2006-07-13

  A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the etch-resistant ink to actinic radiation and/or particle beam radiation to effect polymerisation, removing exposed metal or alloy by a chemical etching process and then removing the polymerised etch-resistant ink by alkali wherein the etch-resistant ink is substantially solvent free and comprises the components: A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono or higher functionality wherein 5-95% by weight is one or more mono-functional monomers; B) 1 to 30 parts acrylate functional monomer containing one or more acid groups; C) 0 to 20 parts polymer or prepolymer; D) 0 to 20 parts radical initiator; E) 0 to 5 parts colorant; F) 0 to 5 parts surfactant; and wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at 40° C. and all parts are by weight.

  一种用于制造电子装置的工艺，该装置包括与导电金属或合金层压的电介质基板，该工艺包括通过喷墨打印将非水性抗蚀刻墨水应用于金属或合金的选定区域，将抗蚀刻墨水暴露于放热辐射和/或粒子束辐射以实现聚合，通过化学蚀刻工艺去除暴露的金属或合金，然后通过碱去除聚合的抗蚀刻墨水，其中抗蚀刻墨水基本上不含溶剂，并包括以下组分：A) 30 至 90 份不含酸基的丙烯酸酯官能团单体，包括单官能团或更高官能团，其中 5-95% （按重量计）为一种或多种单官能团单体；B) 1 至 30 份含有一种或多种酸基的丙烯酸酯官能团单体；C) 0 至 20 份聚合物或预聚合物；D) 0 至 20 份自由基引发剂；E) 0 至 5 份着色剂；F) 0 至 5 份表面活性剂；其中油墨在 40° C 时的粘度不大于 30 cPs (mPa-s)。所有部分均以重量计。