RESIN COMPOSITION, POLYIMIDE RESIN FILM, AND METHOD FOR PRODUCING SAME
申请人:ASAHI KASEI KABUSHIKI KAISHA
公开号:US20180093461A1
公开(公告)日:2018-04-05
Provided is a resin composition characterized by containing (a) a polyimide precursor that has a
308
nm absorbance of 0.1-0.8 when formed into 0.1-μm-thick polyimide resin film by heating for one hour at 350° C., and (b) an alkoxysilane compound having a 308 nm absorbance of 0.1-1.0 at a solution thickness of 1 cm when made into a 0.001-mass % NMP solution.