Resin, photosensitive resin composition, electronic component and display device using the same
申请人:TORAY INDUSTRIES, INC.
公开号:US11333976B2
公开(公告)日:2022-05-17
A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):
Rathore R., Bosch E., Kochi J. K., Tetrahedron, 50 (1994) N 23, S 6727- 6758
作者:Rathore R., Bosch E., Kochi J. K.
DOI:——
日期:——
POLY(ARYLENE ETHER) COMPOSITION AND METHOD
申请人:Yeager Gary William
公开号:US20080076884A1
公开(公告)日:2008-03-27
A composition containing a solvent and a soluble poly(arylene ether) copolymer is described. The poly(arylene ether) copolymer is the product of oxidative polymerization of monomers including a first monohydric phenol having identical substituents in the 2- and 6-positions, and a second monohydric phenol having different substituents in the 2- and 6-positions. The monomers are free of ethylenic unsaturation. The solvent may be a ketone, a dialkylamide, a dialkyl ether, an aromatic hydrocarbon, a chlorinated hydrocarbon, an alkyl alkanoate, an alkyl cyanide, a dialkyl sulfoxide, or a mixture thereof. The poly(arylene ether) has a solubility in the composition of at least 10 grams per kilogram of composition at 25° C.
POLY(ARYLENE ETHER) COPOLYMER
申请人:Yeager Gary William
公开号:US20080085989A1
公开(公告)日:2008-04-10
A poly(arylene ether) copolymer is formed by oxidative copolymerization of monomers including 2,6-dimethylphenol and a phenyl-substituted monohydric phenol having a particular structure. In some instances, the monomers also include 2-methylphenol and/or 2,2-bis(3,5-dimethyl-4-hydroxy)propane. The poly(arylene ether) copolymer is much more soluble than a homopolymer of 2,6-dimethylphenol, and it can be dissolved at room temperature in a wide variety of solvents. The resulting solutions can be used to conveniently add the poly(arylene ether) copolymer to a thermoset composition.
Provided are a polyimide that demonstrates low coefficient of hygroscopic expansion and low water absorption coefficient when used as an insulation film, as well as an ester group-containing tetracarboxylic acid dianhydride expressed by the general formula below, and a novel polyesterimide precursor derived therefrom and polyesterimide, for use in the production of such polyimide:
In the formula, each R is independent and represents a straight or branched-chain alkyl group with 1 to 6 carbon atoms or straight or branched-chain alkoxyl group with 1 to 6 carbon atoms, n is an integer of 0 to 4, and m is an integer of 2 to 4, with the proviso that if m=2, n is an integer of 1 to 4.