A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):
wherein R
1
is hydrogen or methyl, and either R
2
and R
3
represent chlorine and R
4
and R
5
represent hydrogen, or R
2
and R
3
represent hydrogen and R
4
and R
5
represent chlorine.
一种用于无
铅焊接处理
铜或
铜合
金表面的
水基组合物,该组合物包括由通式(1)表示的化合物:
其中R1为氢或甲基,且R2和R3表示
氯,R4和R5表示氢,或者R2和R3表示氢,R4和R5表示
氯。