4-(1-Adamantyl)-2-aminophenol | 899374-31-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4-(1-Adamantyl)-2-aminophenol
• CAS: 899374-31-3
• 化学式: C₁₆H₂₁NO
• mdl: MFCD07022055
• 分子量: 243.349
• InChiKey: SLJXQQVEFXLOAI-UHFFFAOYSA-N

物化性质

• 沸点：
  403.6±45.0 °C(Predicted)
• 密度：
  1.222±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.2
• 重原子数：
  18
• 可旋转键数：
  1
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  46.2
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  4-(1-Adamantyl)-2-aminophenol 、 苯甲醛 在 对甲苯磺酸 、 copper(II) sulfate 、 2,3-二氯-5,6-二氰基-1,4-苯醌 作用下， 以 乙醇 、 二氯甲烷 为溶剂， 生成
  参考文献：
  名称：

  阴离子加速不对称纳扎罗夫环化：获得邻位全碳四元立构中心

  摘要：

  我们开发了一种催化不对称纳扎罗夫环化，可高产率形成两个连续的全碳四元立构中心，并具有出色的不对称诱导水平。该方法不需要在作为简单二酮酯的起始材料中存在催化剂识别元素。起始材料的几何纯E或Z异构体可产生具有高对映选择性的非对映异构纯产物，因为进行环化的物质是构型稳定的烯醇铑。

  DOI：

  10.1039/d3ob00735a
• 作为产物：
  描述：

  4-(adamantan-1-yl)-2-nitrophenol 在 氢气 作用下， 生成 4-(1-Adamantyl)-2-aminophenol
  参考文献：
  名称：

  新型4（1-金刚烷基）苯基类似物作为HIF-1α抑制剂的设计，合成和结构-活性关系研究。

  摘要：

  低氧诱导因子-1（HIF-1）是癌细胞适应肿瘤低氧状态的关键介质。在这项研究中，合成了一系列基于金刚烷的化合物，并将其评估为HIF-1α的潜在抑制剂。通过检查它们的结构活性关系（SAR），可以确定含金刚烷的吲哚衍生物20a在肿瘤缺氧（IC50 = 0.02 µM）下是Hep3B细胞系中HIF-1α的有效抑制剂。本文的研究可为开发针对癌症和肿瘤血管生成的新型疗法提供有价值的信息。

  DOI：

  10.2174/1573406412666151109113007

文献信息

• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same
  申请人：Enoki Takashi

  公开号：US20080255335A1

  公开（公告）日：2008-10-16

  A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R 11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R 11 s may be the same or different from each other; at least one of R 1 to R 5 and at least one of R 6 to R 10 on respective benzene rings are Ar-binding sites or R 11 -binding sites and the others of R 1 to R 5 and R 6 to R 10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R 1 to R 5 and R 6 to R 10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

  提供一种高热稳定性和低介电常数的树脂组合物，其在热处理后具有高热稳定性和低介电常数，以及其清漆和半导体器件。该树脂组合物包括具有以下通式（1）所表示结构的化合物：其中，“Ar”为芳香族基；“a”为0或1；R11为具有一个或多个碳原子的有机基，至少有一个是具有脂环结构的基团；当“q”为2或更多的整数时，R11可以相同或不同；R1至R5中的至少一个和R6至R10中的至少一个在各自的苯环上是Ar结合位点或R11结合位点，而R1至R5和R6至R10中的其他部分分别是氢、具有脂环结构的基团、具有1至10个碳原子的有机基、羟基或羧基；当“a”为0时，R1至R5和R6至R10中的至少一个是具有脂环结构的基团；“q”为1或更多的整数；而“X”为—O—、—NHCO—、—COHN—、—COO—和—OCO—中的任意一种。
• RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME
  申请人：Sumitomo Bakelite Company, Limited

  公开号：EP1813637A1

  公开（公告）日：2007-08-01

  A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition comprising a compound having a structure represented by the general formula (1): wherein, "Ar" is an aromatic group; "a" is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when "q" is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when "a" is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; "q" is an integer of 1 or more; and "X" is any of -O-, -NHCO-, -COHN-, -COO- and OCO-.

  提供了一种经热处理后具有高耐热性和低介电常数的树脂组合物、其清漆以及使用该树脂组合物的半导体器件，该树脂组合物由具有通式 (1) 所示结构的化合物组成： 其中，"Ar "是芳香族基团；"a "是 0 或 1；R11 是具有一个或多个碳原子的有机基团，且至少有一个是具有脂环结构的基团；当 "q "是 2 或 2 以上的整数时，R11s 可以相同或不同；在各自苯环上的 R1 至 R5 和 R6 至 R10 中，至少有一个是 Ar 结合位点或 R11 结合位点，R1 至 R5 和 R6 至 R10 中的其它各为氢、脂环结构基团、具有 1 至 10 个碳原子的有机基团、羟基或羧基；当 "a "为 0 时，R1 至 R5 和 R6 至 R10 中至少有一个是具有脂环结构的基团；"q "是 1 或 1 以上的整数；以及 "X "是-O-、-NHCO-、-COHN-、-COO-和 OCO-中的任意一种。
• RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：EP2000510B1

  公开（公告）日：2012-05-02
• Compositions and methods for the treatment of neurodegenerative diseases
  申请人：Staunton Jane

  公开号：US20060270742A1

  公开（公告）日：2006-11-30

  The invention features compositions and methods for the treatment of neurodegenerative diseases.