Ligand-, base-, co-catalyst-free copper fluorapatite (CuFAP) as a versatile, ecofriendly, heterogeneous and reusable catalyst for an efficient homocoupling of arylboronic acid at ambient reaction conditions
作者:Shafeek A. R. Mulla、Santosh S. Chavan、Mohsinkhan Y. Pathan、Suleman M. Inamdar、Taufeekaslam M. Y. Shaikh
DOI:10.1039/c4ra16760k
日期:——
eco-friendly, recyclable, heterogeneous catalyst for an efficient synthesis of symmetric biaryls from the homo-coupling of arylboronicacids in methanol solvent at ambient reaction conditions. The developed protocol is ligand-, base-, and co-catalyst-free, sustainable, mild, inexpensive, and compatible with a wide range of aromatic/heterocyclic boronic acids and provides the corresponding products in excellent
THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND
申请人:KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
公开号:US20180155370A1
公开(公告)日:2018-06-07
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”)having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.
Despite the Lewis acidic character of MoCl5 it can be employed for the selective oxidative coupling reaction of alkylated anisole derivatives without transalkylation or de-tert-butylation of the substrates. The spatial demand close to the donor function seems to be beneficial.
RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20210397092A1
公开(公告)日:2021-12-23
A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an “m” number of partial structures each independently shown by following formula (3); “m” and “n” each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or —O—(CH
2
)
p
—; “k” represents integer of 1 to 5; “p” represents integer of 1 to 10; R
01
represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material.
A poly(arylene ether) copolymer is the product of oxidative copolymerization of monomers including a monohydric phenol and a dihydric phenol of the formula
wherein R3, R4, R5, and R6 are as defined herein. The poly(arylene ether) copolymer includes less than 0.1 weight percent of incorporated amine groups. A method of the manufacture of a poly(arylene ether) copolymer is also disclosed. A curable composition including the poly(arylene ether) copolymer and cured products derived therefrom are also described.